High-End Semiconductor Device Chip Packaging Vacuum Eutectic Welding Furnace

• After-sales Service: Provide
• Condition: New
• Certification: ISO
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Model NO.: Vsr-20
• Driven Type: Electric
• Product Name: Vacuum Eutectic Welding Furnace
• Application: Chip Packaging
• Advantage: Factory Price
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

Vacuum eutectic welding furnace VSR-20
The classic designed vacuum eutectic reflow soldering system can be equipped with mature technology for formic acid oxidation suitable for low-temperature solder processes, achieving high-quality vacuum eutectic reflow soldering processes, especially suitable for high-end semiconductor device chip packaging applications.

Classic and mature system design
Auxiliary Welding Technology for Formic Acid Deoxidation
PLC touch screen control system or Windows control system

[Configuration Options]
Vacuum system, additional process gas path, various oxidation removal process modules, customized heating plate, additional temperature measurement thermocouple, circulating chiller

[Product Features]
Fast and accurate temperature curve control
Formate Deoxidation Ability Suitable for Low Temperature Solders
Accurate and automatic process gas flow control
Integrated design of heating plate and workpiece fixture
A simple and convenient operating system

 

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.