Zqx Automatic Cleaning Machine for Semiconductor Process Industry/ Mems LED Photovoltaic/ Chemical

• After-sales Service: Provide
• Warranty: 12 Months
• Product Name: Semiconductor Wet Processing Equipment
• Function: Wet Processing
• Certification: ISO
• Condition: New
• Model NO.: ZQX
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

  

SQX series Manual cleaning machine

SQX series manual cleaning machine is designed as a kind of manual operating wet chemimal equipment to remove the organic materials 
(in cludling photoresist ), particles , metal impurities, natural oxiding layer on the surface of wafer and to remove the pollutant of quartz or plastic containers while processing semiconductor integrated circuits, semiconductor materials, LED, OLED, nano tabrications, MEMS TSV, etc.

 

ZQX Automatic Cleaning Machine

ZQX wafer cleaning machine , which adopts standard RCA cleaning process, can be used in the areas such as semiconductor process industry, MEMS LED photovoltaic, chemical, etc.

Cleaning ash cleaning after polishing, before oxidation, before epitaxy, ion implantation, lithography and other processes etc

 

DPX series single chip cleaning/scrubbing machine

Single chip cleaning/brushing machine is mainly used in semiconductor industry after diffusion, metal deposition, CMP after wafer corrosion cleaning and various substrate polishing scrub process

All plastic structure(NPP or PTFE)
Compatible with various specifications of chuck
Visible cleaning/ etching process
The liquid chemicals are heated during circulation
Wafer flip function, can be back and front cleaning
Equipped with nitrogen atomization two fluid cleaning
Waste recycling

 

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.