• Sic UV Laser Annealing Machine for Bsi-CCD Wafer with Precise Energy Density Control
  • Sic UV Laser Annealing Machine for Bsi-CCD Wafer with Precise Energy Density Control
  • Sic UV Laser Annealing Machine for Bsi-CCD Wafer with Precise Energy Density Control
  • Sic UV Laser Annealing Machine for Bsi-CCD Wafer with Precise Energy Density Control
  • Sic UV Laser Annealing Machine for Bsi-CCD Wafer with Precise Energy Density Control
  • Sic UV Laser Annealing Machine for Bsi-CCD Wafer with Precise Energy Density Control

Sic UV Laser Annealing Machine for Bsi-CCD Wafer with Precise Energy Density Control

Condition: New
Warranty: 12 Months
Automatic Grade: Automatic
Installation: Vertical
Driven Type: Electric
Product Name: Sic Laser Annealing La
Customization:
Gold Member Since 2023

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Jiangsu, China
QA/QC Inspectors
The supplier has 1 QA and QC inspection staff
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The supplier has 1 R&D engineers, you can check the Audit Report for more information
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  • Overview
  • Product Description
  • Application
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Feature 1
High Reliability and Stability
Feature 2
Independly Developped Optical System
OEM/ODM Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Product Description
Sic UV Laser Annealing Machine for Bsi-CCD Wafer with Precise Energy Density Control
Product Features
  • First domestic green laser machine for mass pruduction

  • High reliability and stability

  • Independly developped Optical system, LIET technology with IP

  • Green/UV laser two wavelengths are optional

Technical specification
Wafer Size 6 inch,8 inch
Spot size X:100~500μm Y:100~500μm
Max. laser energy density Green:10J/cm2 UV:6J/cm2
Specific contact resistance ~10-5Ω·cm2
Oxygen control ≤10ppm
Application


Sic UV Laser Annealing Machine for Bsi-CCD Wafer with Precise Energy Density Control

Exhibition & Customers

Sic UV Laser Annealing Machine for Bsi-CCD Wafer with Precise Energy Density ControlSic UV Laser Annealing Machine for Bsi-CCD Wafer with Precise Energy Density ControlJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

Sic UV Laser Annealing Machine for Bsi-CCD Wafer with Precise Energy Density Control
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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