Direct Imaging System Connection Equipment Equipped with Optimized Target Identification Systen

Product Details
Customization: Available
After-sales Service: Provided
Warranty: 12 Months
Gold Member Since 2023

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  • Direct Imaging System Connection Equipment Equipped with Optimized Target Identification Systen
  • Direct Imaging System Connection Equipment Equipped with Optimized Target Identification Systen
  • Direct Imaging System Connection Equipment Equipped with Optimized Target Identification Systen
  • Direct Imaging System Connection Equipment Equipped with Optimized Target Identification Systen
  • Direct Imaging System Connection Equipment Equipped with Optimized Target Identification Systen
  • Direct Imaging System Connection Equipment Equipped with Optimized Target Identification Systen
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  • Overview
  • Product Description
  • Application
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
LDI - M30 SERIES
Driven Type
Pneumatic
Product Name
Laser Direct Imaging System
Advantage 1
High Resolution
Advantage 2
High Efficiency Processing
After-Sale Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Product Description
Product features and advantages:
Deep cultivation of inner wet film field , special wet film processing efficiency breakthrough , up to 10500 panels / day
With high quality and high power composite wave length laser light source , to achieve high adaptability of different photosensitive materials
Equipped with optimized target identification systen
Exposure process is all digital operation , enter the industry 4.0 intelligent manufacturing


Direct Imaging System Connection Equipment Equipped with Optimized Target Identification Systen
Direct Imaging System Connection Equipment Equipped with Optimized Target Identification SystenDirect Imaging System Connection Equipment Equipped with Optimized Target Identification SystenLDI - S30 SERIES Direct imaging system Solder mask exposure
Direct Imaging System Connection Equipment Equipped with Optimized Target Identification SystenDirect Imaging System Connection Equipment Equipped with Optimized Target Identification Systen
 
Application

Direct Imaging System Connection Equipment Equipped with Optimized Target Identification Systen

Exhibition & Customers

Direct Imaging System Connection Equipment Equipped with Optimized Target Identification SystenDirect Imaging System Connection Equipment Equipped with Optimized Target Identification SystenJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

Direct Imaging System Connection Equipment Equipped with Optimized Target Identification Systen
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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