Sic Power Devices Used in Electric Vehicles/ Charging Piles/ Photovoltaic Inverters/High-Speed Rail/ Rail Transit/Smart Grid/ Industrial Power Supply

• Customization: Available
• After-sales Service: Provide
• Warranty: 12 Months
• Model NO.: SiC power devices
• Product Name: Sic Material Preparation Equipment
• Application: Sic Power Devices
• Certification: ISO
• Condition: New
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

  The production process equipment and application of silicon carbide materials are the core industries of the second institute focusing on third-generation semiconductor technology. Relying on independently developed core processes and equipment such as long crystal furnaces, laser glass equipment, and epitaxial furnaces, we integrate domestic and foreign resources, provide customers with integrated solutions for silicon carbide materials, processes, and equipment systems, break foreign monopolies, and help the rapid development of China's third-generation semiconductor industry.

SiC material preparation equipment and production line

SiC power devices are used in electric vehicles, charging piles, photovoltaic inverters, high-speed rail, rail transit, smart grid, industrial power supply and other fields, and can gradually replace silicon based MOSFET and IGBT.

 

 

 

SiC chip production line

SiC chip and module

Product:SiC Schottky diode chip, silicon carbide MOSFET chip and module.

Application area:The application fields of the third generation semiconductor materials and devices include power grid, electric traction, power supply, electric vehicles, household appliances, medical equipment and consumer electronics. SiC products are mainly used in photovoltaic, electric vehicle charging piles, power electronic transformers and other fields.

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.