| Customization: | Available |
|---|---|
| After-sales Service: | Provided |
| Warranty: | Provided |
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Audited Supplier Audited by an independent third-party inspection agency
1. With high-performance UV laser, the laser cutting heat-affected zone is small and it can more efficiently process the high-density and highly integrated PCBA product
2. The self-developed control software has functions of multiple jointed board cutting, automatic focusing and distortion compensation to achieve high-precision processing
3. With the high-precision motion platform system and high-precision galvanometer scanner, the cutting precision is high
4. The high-precision CCD positioning system can ensure the product's processing precision.
Application Field:
1. Suitable for precision cutting, half cutting, trenching of materials such as FPCBA, PCBA, RF, CVL and SIP
2. Applicable for the high-quality cutting of coverlay, PI, FR4, FR5 and CEM materials
3. Applicable for the precise processing of electronic industry like mobile phone fingerprint module, camera module, integrated chip.
| Equipment parameters | |
| Machine model | HDZ-UVC3030 |
| Control system | (imported from Germany) square head + control card, Windows 7 |
| Final processing repeated positioning precision | ±0.02mm |
| Max. processing area | 300mm*300mm |
| Camera positioning system | 5MP |
| Support file format | Dxf, plt and so on |
| Overall dimension (for reference) | 1060*1000*1850mm |
| Power supply | 220V, 50Hz, 6kW |
| Laser | |
| Wavelength | 355nm |
| Power | 10W/15W |
| Min. line width | 0.03mm |
| Fθ lens | Box:50*50mm |
| Cooling mode | Water cooling |
| 2D platform | |
| Stroke | 400mm*300mm |
| Repeated positioning precision | ±0.002mm |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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