Manufacture Laser Trimming Machine for LED, Mini LED Direct Display Module

• Customization: Available
• After-sales Service: Provided
• Condition: New
• Warranty: Provided
• Automatic Grade: Manual
• Installation: Vertical
• Driven Type: Pneumatic
• Product Name: Laser Trimming
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

 

Product Description

Product Features

• Custom C0₂ or UV/Green picosecond laser

• Self-developed software and processing technology that meets different process requirements

• Glue removal and window opening

• Support multiple features for visual positioning

 

Application

Used for LED, Mini LED direct display
module after plastic sealing defect
repair, circuit board industry line repair,
tin ball rework, etc.
Through the upstream mes system to
export Mapping map coordinates, visual
positioning of defective areas, laser
removal, for subsequent process repair

 

Technical specification
Laser Type	CO2 ,UV/Green picosecond
Laser power	30W
Cutting dynamic range	180×180mm
CCD field of view	80×80mm
XY drive mode	Servo motor
X-axis stroke	300mm
Double Y-axis travel	200mm

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.