Good Cutting Verticality Customized High Efficiency PCB Module Laser Cutting Intelligent Equipment

• Customization: Available
• After-sales Service: Provided
• Condition: New
• Warranty: Provided
• Automatic Grade: Manual
• Installation: Vertical
• Driven Type: Pneumatic
• Product Name: PCB Module Laser Cutting
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

 

Product Description

Product Features

• Staggered cutting with double stations for high efficiency

• Adopt telecentric lens, good cutting verticality

• Off-axis CCD automatic positioning system, high cutting accuracy

• Complete full monitoring and feedback capability

• Automatic loading and unloading, high-speed placement, defect detection, etc.

 

Application

PCB/FPC/RF/TouchID/Type-C/
TF-Card/LGA/BGA and other
types of modules, circuit boards,
packaging IC carrier board
precision cutting and post-cutting
inspection, scheduling, etc

Technical specification
Laser Type	UV	Green
Laser Power	15W/20W/30W 35W/40W/60W	15W/20W/30W 35W/40W/60W
Cutting Range	300×200mm(customizable)
Cutting Accuracy	±30μm
Cutting Accuracy	±0.1mm
Max. cutting thickness	≤2mm
Min. cutting line width	<20μm

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.