• Laser Induced Epitaxial Growth Machine with High Precise Beam Combination Technology and Modulation Technology for Multi-
  • Laser Induced Epitaxial Growth Machine with High Precise Beam Combination Technology and Modulation Technology for Multi-
  • Laser Induced Epitaxial Growth Machine with High Precise Beam Combination Technology and Modulation Technology for Multi-
  • Laser Induced Epitaxial Growth Machine with High Precise Beam Combination Technology and Modulation Technology for Multi-
  • Laser Induced Epitaxial Growth Machine with High Precise Beam Combination Technology and Modulation Technology for Multi-
  • Laser Induced Epitaxial Growth Machine with High Precise Beam Combination Technology and Modulation Technology for Multi-

Laser Induced Epitaxial Growth Machine with High Precise Beam Combination Technology and Modulation Technology for Multi-

Condition: New
Warranty: 12 Months
Automatic Grade: Automatic
Installation: Vertical
Driven Type: Electric
Product Name: Laser Induced Epitaxial Growth Machine
Customization:
Gold Member Since 2023

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Jiangsu, China
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  • Overview
  • Product Description
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Feature 1
Modulation Technology
Feature 2
High Productivity
OEM/ODM Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Product Description
Laser Induced Epitaxial Growth Machine with High Precise Beam Combination Technology and Modulation Technology for Multi-
Product Features
  • First domestic 12 inch mass production equipment

  • High precise beam combination technology and modulation technology for Multi- laser

  • Rectangular Top-hat beam with large size, high productivity

  • Energy density  accuracy down to 5mJ/cm2
     

    Application
    Laser-induced epitaxial growth
    and void elimination of amorphous
    silicon in ultra-small via with large
    aspect ratio
Technical specification  
Laser wavelength 532nm
Wafer size 12 inch
Energy Density accuracy 5mJ/cm2
Uniformity of beam top ≤1%
Focal depth range 5mm
Process Effect Crystallization and void elimination
 
Exhibition & Customers

Laser Induced Epitaxial Growth Machine with High Precise Beam Combination Technology and Modulation Technology for Multi-Laser Induced Epitaxial Growth Machine with High Precise Beam Combination Technology and Modulation Technology for Multi-Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

Laser Induced Epitaxial Growth Machine with High Precise Beam Combination Technology and Modulation Technology for Multi-
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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