| Customization: | Available |
|---|---|
| After-sales Service: | Provide |
| Condition: | New |
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1,Scope of application
Small and integrated wastewater treatment equipment, waste gas treatment device, precious metal recovery device, electroplating wastewater reuse "zero discharge" system, special hanger mechanism (rotating electroplating mechanism, vibrating screen, roller, etc.), automatic analysis and adding system of plating bath, integrated circulating filter inside the inlet slot, fast electric power acquisition module, etc.
2,application area
It is mainly used for rolling, hanging, vibrating and other wet chemical processes, such as electroplating, electroforming, chemical plating, oxidation and cleaning, for military industry, electronics and new materials.
3,Equipment features
1, customized design according to user's technological requirements, and can be designed by linear, L and U structure respectively.
2, each process unit adopts relatively independent standardization and modular design, and the process combination is more flexible.
3, the structure is simple and practical, operation and maintenance is more concise and convenient.
4. The non operational surface of the control panel (box) of each process tank is placed nearby, and the control system is separated by strong and weak electricity, and the operation is more safe and reliable.
5, special process tank system configuration leakage monitoring system and the use of double groove safety protection design;
6, the equipment is uniform, beautiful and generous, convenient maintenance, repair and on-site management.
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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