Wafer Laser Marking Machine

Product Details
Customization: Available
Certification: ISO9001, CCC
Protection: Anti-static
Gold Member Since 2023

Suppliers with verified business licenses

Audited Supplier

Audited by an independent third-party inspection agency

QA/QC Inspectors
The supplier has 1 QA and QC inspection staff
R&D Capabilities
The supplier has 1 R&D engineers, you can check the Audit Report for more information
to see all verified strength labels (14)
  • Wafer Laser Marking Machine
  • Wafer Laser Marking Machine
  • Wafer Laser Marking Machine
  • Wafer Laser Marking Machine
  • Wafer Laser Marking Machine
  • Wafer Laser Marking Machine
Find Similar Products

Basic Info.

Model NO.
HM-L100
Installation
Vertical
Housing
ABS and Metal
Wave Length
532nm
Wafer Size
8 Inch and 12 Inch
Operate Model
Automatic
Accuracy
0.0005mm
Transport Package
Complies with International Logistics Standards
Specification
532nm wave length
Trademark
Himalaya
Origin
China
Production Capacity
50000

Product Description

 Description:
   
The common green laser refers to a laser with a wavelength of 532nm. Working principle: There is an infrared laser tube with a wavelength of 808nm inside the laser, which is used to pump (excite) YVO4 laser crystal to emit 1064nm far-infrared laser. The 1064nm far-infrared laser is halved in wavelength and doubled in frequency after passing through a doubling crystal, generating 532nm green laser.
    Cost advantage: Under the premise of meeting customer requirements, choosing a cost-effective solution, the cost of green laser is significantly lower than that of ultraviolet laser, and the cost of 532nm galvanometer lens is sharply reduced compared to imported ultraviolet galvanometer lens. The same applies to 532nm flat field lens compared to ultraviolet flat field lens.
     Average power advantage: Under the same procurement cost, the average power of green light is obviously much higher than that of ultraviolet light. Green light with high average power is much faster in cutting efficiency than ultraviolet light, directly improving laser cutting efficiency and reducing cutting time costs.
    Fine laser engraving: The lines can reach the micrometer level, and it is very difficult to imitate and modify the markings made using laser marking technology, which is extremely important for product anti-counterfeiting.

Main parameters:

○ Imprint specifications: Number or letter font height ≥ 0.12mm, font width ≥ 0.12mm, font depth ≤ 0.015mm;
○ Suitable wafer specifications for marking: 8-inch wafer, 12 inch wafer;
○ Scanning range of galvanometer ≥ 35mmx35mm, marking position deviation ≤± 20 μ m;
Surface quality: The font is complete, uninterrupted, clear and visible, without ghosting, and the line width is ≤ 20 μ m;
○ The repeatability accuracy of the entire printed imprint is less than ± 0.02mm;
○ Dual CCD positioning, double-sided positioning;
○ Platform positioning accuracy ± 0.0005mm;
The software has the function of recognizing barcode parameter switching and automatically replacing characters;
The software has a manual offset input function to solve the irregular marking offset phenomenon on Wafer;
○ Automatic generation of Mapping File function: It can generate a virtual die distribution map that overlaps with the actual graphics based on parameters;
 ○ Modular design and international brand configuration ensure stable operation of the equipment.


Wafer Laser Marking Machine
Wafer Laser Marking Machine
Wafer Laser Marking Machine

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now
Contact Supplier