• Factory Supply High-Power Sic Ingot Laser Slicing Equipment with Smooth Processing Surface
  • Factory Supply High-Power Sic Ingot Laser Slicing Equipment with Smooth Processing Surface
  • Factory Supply High-Power Sic Ingot Laser Slicing Equipment with Smooth Processing Surface
  • Factory Supply High-Power Sic Ingot Laser Slicing Equipment with Smooth Processing Surface
  • Factory Supply High-Power Sic Ingot Laser Slicing Equipment with Smooth Processing Surface
  • Factory Supply High-Power Sic Ingot Laser Slicing Equipment with Smooth Processing Surface

Factory Supply High-Power Sic Ingot Laser Slicing Equipment with Smooth Processing Surface

After-sales Service: Provided
Condition: New
Certification: ISO
Warranty: 12 Months
Automatic Grade: Automatic
Product Name: Semiconductor Equipment
Customization:
Gold Member Since 2023

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Jiangsu, China
QA/QC Inspectors
The supplier has 1 QA and QC inspection staff
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The supplier has 1 R&D engineers, you can check the Audit Report for more information
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  • Overview
  • Product Description
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Feature 1
Guaranteed Quality
Feature 2
Customized According to Needs
After-Sale Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Product Description
Factory Supply High-Power Sic Ingot Laser Slicing Equipment with Smooth Processing Surface
Equipment features:
1. High dynamic and high-power femtosecond laser
2. High precision optical scanning processing system
3. High flexibility and high efficiency stripping system
4. Smooth processing surface, low material consumption, and high wafer yield
5. Fast processing efficiency and high yield rate
6. Large size machining, 8inch
7. Ultra thin wafer processing with good material compatibility



Application scope: Used in third-generation semiconductor SiC ingot laser slicing, SiC ultra-thin wafer laser slicing and other fields.

Factory Supply High-Power Sic Ingot Laser Slicing Equipment with Smooth Processing Surface

 
Exhibition & Customers

Factory Supply High-Power Sic Ingot Laser Slicing Equipment with Smooth Processing SurfaceFactory Supply High-Power Sic Ingot Laser Slicing Equipment with Smooth Processing SurfaceJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

Factory Supply High-Power Sic Ingot Laser Slicing Equipment with Smooth Processing Surface
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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