Product Description
HgTe material single crystal growth furnace
Mercury telluride crystal materials have broad
applications in the field of large array infrared detectors.
The equipment adopts a five temperature zone thermal
field structure. Through the simulation and calculation
of the thermal field in the furnace, the temperature
distribution of the furnace body in different crystal
growth stages is obtained, and the corresponding
temperature gradient and heat flux density distribution
are obtained. The equipment has mature and stable
process operation, high degree of automation of the
control system, automatic alarm function and perfect
system protection function.
High pressure synthesis furnace for telluride
semiconductor materials
With the increasing requirements of HgCdTe infrared
focal plane devices for substrate size and the increasingly
complex synthesis process, the high-pressure synthesis
furnace of Telluride semiconductor materials is mainly
used for the high-pressure synthesis of CdZnTe and other
materials. The equipment is a single bedroom structure,
which is composed of furnace body, heat field, crucible
system, water cooling system and electrical control.
It adopts three zone temperature control. The control
system has automatic alarm and perfect system protection
functions.
InSb zone furnace with high temperature control accuracy
The equipment uses zone melting method to purify
indium antimonide and other materials, so as to obtain high
purity indium antimonide and other materials for infrared
detection devices. By locally heating the material to the
molten state, the impurities that are easily soluble in the
liquid phase migrate to the melting zone, while the impurities
that are difficult to dissolve in the liquid phase are deposited
in the solid phase in the opposite direction of the melting
zone. After multiple zone melting, cut off the two ends of the
material rod, retain the middle part, zone melting again, and
finally obtain the material with higher purity.
Application
Exhibition & Customers
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Packaging & Shipping
FAQ
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.