Fully Automatic Modular Design Oxidation Diffusion Lpcvd Furnace

• After-sales Service: Provide
• Condition: New
• Certification: ISO
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Model NO.: LPCVD furnace
• Driven Type: Electric
• Product Name: Fully Automatic Oxidation Diffusion Lpcvd Furnace
• Application: IC Integrated Circuits
• Feature 1: Fully Automatic
• Feature 2: Modular Design
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

Product performance:
Fully automatic: Cassette to Cassette
Modular design, SEMI standard
Meet the 4-8/12 inch wafer process
1-4/5 tubes per unit, quartz/SiC reaction tubes
Constant temperature zone: 800/1000/12500
Temperature: 200-1300 ºC/1350 ºC
Fully automatic robotic arm loading and unloading, cantilever/soft landing
High integration, complete factory MES system integration

Supporting technology:
Diffusion furnace: Gas/liquid/solid source phosphorus boron diffusion
Oxidation furnace: dry oxygen/wet oxygen (DCE, HCL)
Nitrogen and hydrogen annealing, sintering, alloying, curing, etc
Gallium and aluminum diffusion, LP POCl3
LPCVD process: polycrystalline silicon P-Si, silicon nitride Si3N4, silicon oxide SiO2, phosphorus silicon glass PSG, boron phosphorus silicon glass BPSG, TEOS, LTO, HTO, SIPOS
PECVD process: silicon nitride, silicon oxide, etc

 

 

Application

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.