Automatic Loading and Unloading Semiconductor Laser Grooving Machine for Mass Production

• After-sales Service: Provided
• Function: Laser Grooving
• Demoulding: No
• Condition: New
• Certification: ISO
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Electric
• Mould Life: Laser Warranty for One Year
• Product Name: Wafer Laser Grooving
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• OEM/ODM Service: Provided
• Transport Package: Complies with International Logistics Standards
• Specification: 1400 x2400x 2440 (including tricolor light)
• Trademark: Himalaya
• Origin: China
• Production Capacity: 1

Product Description

 

This machine is a specialized equipment for semiconductor wafer Laser Grooving, designed as a fully automatic model, and adopts a plug type (customized special) material box feeding method. The equipment integrates high-performance, high-power, and ultra fast lasers, providing long-term stable and high-quality laser output performance. It is equipped with high-precision robotic arms and motion platforms to ensure accurate processing.

Product features
1. Adopting specially customized pulse width laser processing, specifically tailored for wafer laser processing;
2. Adopting ultra short pulse width processing to effectively improve the quality of cutting lines;
3. After specially customized pulse width slotting, the heat affected zone is less than 2um;
4. Integrate multiple laser microfabrication technologies to achieve both cutting efficiency and process window;
5. Multiple conventional cutting function combinations for switching and selection;
6. Adopting Mask+TOP-HAT spot combination module;
7. Optimized dual path processing module;
8. Adopting a high-precision visual inspection system;
9. Compatible with 8 inches and 12 inches;
10. Automatic loading and unloading function, unmanned and fully automatic operation, mass production.

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.