• Automatic Substrate Laser Marking Machine with High-Precision Digital Scanning Oscillator
  • Automatic Substrate Laser Marking Machine with High-Precision Digital Scanning Oscillator
  • Automatic Substrate Laser Marking Machine with High-Precision Digital Scanning Oscillator
  • Automatic Substrate Laser Marking Machine with High-Precision Digital Scanning Oscillator
  • Automatic Substrate Laser Marking Machine with High-Precision Digital Scanning Oscillator
  • Automatic Substrate Laser Marking Machine with High-Precision Digital Scanning Oscillator

Automatic Substrate Laser Marking Machine with High-Precision Digital Scanning Oscillator

After-sales Service: Provided
Warranty: 12 Months
Driven Type: Pneumatic
Product Name: Automatic Substrate Laser Marking
Feature 1: Guaranteed Quality
Feature 2: Customized According to Needs
Customization:
Gold Member Since 2023

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Jiangsu, China
QA/QC Inspectors
The supplier has 1 QA and QC inspection staff
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  • Overview
  • Product Description
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

After-Sale Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Product Description
Automatic Substrate Laser Marking Machine with High-Precision Digital Scanning Oscillator
Product Features
  • Flexible configuration of fiber lasers, green lasers, UV lasers, etc.

  • High-precision digital scanning oscillator & Mechanical + CCD positioning to ensure marking accuracy

  • Robotic automatic loading and unloading & Magazine material storage box & Dual-module bench marking

  • With anti-reverse and QR code / character rating detection and other functions

     

    Application
    Fully automatic laser marking of
    substrate products such as
    BGA/LGA/SIP
Technical specification  
Laser wavelength 1064nm/532nm/355nm
Laser power 10-30W
Positioning accuracy ±5μm
Marking depth 0.008-0.2mm adjustable
Min. character 0.18mm
Repeat Positioning Accuracy ±3μm
UPH ≥50 plates/hr
Max. loading volume at one time Standard material box 4 boxes, 80mm wide
Exhibition & Customers

Automatic Substrate Laser Marking Machine with High-Precision Digital Scanning OscillatorAutomatic Substrate Laser Marking Machine with High-Precision Digital Scanning OscillatorJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

Automatic Substrate Laser Marking Machine with High-Precision Digital Scanning Oscillator
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

 

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