Product Description
Processing principle:
Laser internal modification cutting is a cutting technique that concentrates an infrared laser beam inside a wafer, forms an internal "modification layer" for segmentation through scanning, and then applies external force to the wafer to divide it into a single chip.
Equipment Introduction: Based on a mature LED slicing machine platform
Higher precision and higher efficiency high-power cutting equipment emitted
Prepare DSI-MC-9201.
High power laser, combined with new optical path system
The use of three different wavelength backlight sources can be compatible with the current market
Visual positioning of all mainstream chips in the field
DRA response accuracy of 50Hz @ ± 5um
Automatic barcode scanning function, combined with production information upload function.
Automatic wide-angle contour correction
Automatic horizontal correction.
Automatic focusing function
1 Laser China U-fast 1
3.0W@50KHZ ; 3.5W@100KHZ (Light outlet)
50~200KHZ can be set
1X/Y linear workbench
Self made 400 * 600 XY 1
Travel: 400X600mm
Resolution: Y=0.1 μ M; X=0.5um
Y repeated positioning accuracy:<=1 μ M (see Appendix 1)
X straightness: 1um/300mm (see Appendix 2)
DD motor
And driver inlet/1
1) Maximum speed: 2.4rps
2) Rated speed: 2.0rps
3) Encoder resolution: 26214400 p/rev
4) Installation surface flatness: less than 10um
3 CCD outsourcing/4
Wide angle 500W
Correction of size and angle by 1.3 million pixels;
Focusing 300000 pixels
High pixel telephoto lens
4 Z-axis inlet/2
1) 0-8mm range
2) Repetitive positioning accuracy:+/-1um
1. Mini LED cutting appearance quality improvement:
In response to the appearance quality requirements of Mini LED products, the 9201 cutting machine has increased the straightness of the back cutting from around 10um to<6um;
2. DRA cutting depth compatibility and improved stability
New type of sensor, better compatible with MINI film sources, can measure products with thinner film thickness, and improve tracking
The adaptability of the system to the product. Improve the stability of cutting depth.
3. Exclusive laser with independent property rights
By optimizing and improving lasers and independently developing competitive lasers, we aim to enhance the quality of laser cutting of LED chips.
5. New Vision: Equipped with three different bands of backlight, with wider compatibility and automatic visual recognition and positioning.
6. Main data
Appearance yield: ≥ 99.5%
Electrical yield: industry-leading level
Efficiency: 30 Product dimensions: 9 * 27mil, with a production capacity of ≥ 7500 pieces per month for four inch pieces and ≥ 5000 pieces per month for six inch pieces.
Stability: Machine transfer rate ≥ 96%.
7. Since the development of the equipment, multiple technical difficulties have been overcome, and many technologies are pioneering in the industry. And has applied for multiple patents.
Patent number: 201410284055. X A dual focus laser microfabrication device and its processing method
Patent number: 201510036080.0 Laser Output Device and Sapphire Trenching Method
Patent number: 201610702455.7 Laser processing system and laser focusing method
Patent number: 201610702497.0 Laser processing method for LED wafers
Patent number: 201610702499. X Dual focus laser processing system and its processing method
Patent number: 201510239300. X Laser cutting method for sapphire
Patent number: 201210516818. X Scoring method and device
Patent number: 201680000488.5 Method and device for cutting sapphire
Patent number: 201811315480.5 A laser processing device and method
Patent number: 201821821062.9: A laser processing spacing adjustment structure
Patent number: 201822267163.2 Adjustment device
Patent number: 201822197754.7 Adjustment device
Patent number: 201822197380.9 Regulating device
1. Power requirement: 220V/single-phase/50Hz/16A; Power grid fluctuations:<5%
The device power plug is a standard triple flat plug
2. Environmental temperature: 22-26 ºC; Temperature variation ± 1 ºC
3. Environmental humidity of 40-70% without condensation
Compressed air of 0.6~0.7MPa, equipment interface pipe diameter φ 12mm
5 Environmental vibration requirements: Foundation amplitude<5 μ Vibration acceleration<0.05G
6 occasions to avoid
Places with a lot of garbage, dust, and oil mist;
Places with high vibrations and impacts;
Places that can reach drugs and flammable and explosive materials;
Places near high-frequency interference sources;
Places where temperature changes rapidly;
In environments with high concentrations of CO2, NOX, SOX, etc
Comprehensive after-sales service:
Da Zu Laser has a comprehensive sales and service system, with personnel stationed in each area to respond to customer needs anytime, anywhere.
Establish a comprehensive spare parts library to ensure that original parts
Quality is consistent
Regularly maintain and upkeep the equipment to ensure its safety
Stable and safe use, allowing for troubleshooting in its early stages
Free training for customer related personnel to ensure
Standardized use of equipment
Provide free technical consultation to customers
Exhibition & Customers
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Packaging & Shipping
FAQ
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
Audited Supplier 
Equipment Introduction: Based on a mature LED slicing machine platform
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