• Laser Decapping Machine with Position Preview Function for Packaging & Testing Line
  • Laser Decapping Machine with Position Preview Function for Packaging & Testing Line
  • Laser Decapping Machine with Position Preview Function for Packaging & Testing Line
  • Laser Decapping Machine with Position Preview Function for Packaging & Testing Line
  • Laser Decapping Machine with Position Preview Function for Packaging & Testing Line
  • Laser Decapping Machine with Position Preview Function for Packaging & Testing Line

Laser Decapping Machine with Position Preview Function for Packaging & Testing Line

After-sales Service: Provided
Condition: New
Warranty: 12 Months
Automatic Grade: Automatic
Installation: Vertical
Driven Type: Electric
Customization:
Gold Member Since 2023

Suppliers with verified business licenses

Jiangsu, China
QA/QC Inspectors
The supplier has 1 QA and QC inspection staff
R&D Capabilities
The supplier has 1 R&D engineers, you can check the Audit Report for more information
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  • Overview
  • Product Description
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Product Name
Laser Decapping
Feature 1
Guaranteed Quality
Feature 2
Customized According to Needs
OEM/ODM Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Product Description
Laser Decapping Machine with Position Preview Function for Packaging & Testing Line
Product Features
  • Position preview function,flexible setting of open cover shape, position and size

  • Laser distance measurement with automatic focus,CCD video coaxial observation of laser decaping effect

  • Automatic software control of decaping depth

  • Online dust collection and vacuum device

 

Application
Analysis of product failure in
Packaging & testing line and
laboratories
Technical specification  
Laser Type Fiber Laser / CO2 Laser
Laser power 30W/50W
Min. decaping size 0.1×0.1mm
Decaping depth 10mm±0.02mm
One time decaping range 50×50mm
 
 

 
Exhibition & Customers


Laser Decapping Machine with Position Preview Function for Packaging & Testing LineLaser Decapping Machine with Position Preview Function for Packaging & Testing LineJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

Laser Decapping Machine with Position Preview Function for Packaging & Testing Line
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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