• Cts100/Cts200/Cts300 Screen Direct Plate Making Machine
  • Cts100/Cts200/Cts300 Screen Direct Plate Making Machine
  • Cts100/Cts200/Cts300 Screen Direct Plate Making Machine
  • Cts100/Cts200/Cts300 Screen Direct Plate Making Machine
  • Cts100/Cts200/Cts300 Screen Direct Plate Making Machine
  • Cts100/Cts200/Cts300 Screen Direct Plate Making Machine

Cts100/Cts200/Cts300 Screen Direct Plate Making Machine

After-sales Service: Provide
Condition: New
Certification: ISO
Warranty: 12 Months
Automatic Grade: Automatic
Installation: Vertical
Customization:
Gold Member Since 2023

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Jiangsu, China
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  • Overview
  • Product Description
  • Application
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
CTS100/CTS200/CTS300
Driven Type
Electric
Product Name
Screen Direct Plate Making Machine
Application
Line Application
Advantage
Factory Price
After-Sale Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Product Description
Product advantages
various laser energy to meet various client applications.
efficient and high-energy optical design
comprehensively reduce equipment ownership and operating costs
Cts100/Cts200/Cts300 Screen Direct Plate Making Machine
Cts100/Cts200/Cts300 Screen Direct Plate Making Machine
Maximum Mesh Size 1200mm×1000mm
Maximum Imaging Size 1100mm×900mm
Exposure mesh frame thickness 20mm-40mm
Exposed mesh frame unevenness ±0.5 mm
Graphic generator 0.7" DMD (1024*768 [email protected])
Spot size 30*30µm
Process analysis 40µm/40µm (may behave differently due to different photosensitive materials)
Process mass production 60µm/60µm (may behave differently due to different photosensitive materials)
Data resolution 12700dpi
Optical depth of field ±300µm
Focus mode dynamic real-time focus
Repeat accuracy ±5µm
Capacity (excluding upper and lower substrate time) 135s-180s/side @ 900mm× 900mm & 30mj/cm² (may perform differently due to different processes)
Exposure sensitive adhesive thickness 2~130 µm (including screen thickness)
Inhomogeneity of exposure photosensitive tape ±5%
Light source output wavelength 405nm UV Laser
Laser energy 16W
Application line application
Input file format Gerber274X
Rated voltage Single Phase 220V±10%-50HZ(L+N+PE)-4KW
Deionized water 15L
Mainframe weight 3500kg
Host size (length*width*height)  
Rated compressed air pressure 0.4 Mpa - 0.8 Mpa
Ambient temperature/ambient humidity 22ºC±2ºC/30%-70% (no condensation)
Application/input file format/performance network application/1-Bit-Tiff/133lpi 6%-94% network reproduction
Optional laser energy 20W/24W
Optional data resolution 6350dpi / 25400dpi (higher resolution imaging speed will be reduced)
 
Maximum Mesh Size 1300mm×1200mm
Maximum Imaging Size 1200mm×1100mm
Exposure mesh frame thickness 20mm-40mm
Exposed mesh frame unevenness ±0.5 mm
Graphic generator 0.95" DMD(1920*1080 [email protected]μm)
Spot size 30*30µm
Process analysis 40µm/40µm (may behave differently due to different photosensitive materials)
Process mass production 60µm/60µm (may behave differently due to different photosensitive materials)
Data resolution 6350dpi
Optical depth of field ±300µm
Focus mode dynamic real-time focus
Repeat accuracy ±5µm
Capacity (excluding upper and lower substrate time) 75~100s/side @ 900mm×900mm & 30mj/cm² (may perform differently due to different processes)
Exposure sensitive adhesive thickness 2~130 µm (including screen thickness)
Inhomogeneity of exposure photosensitive tape ±5%
Light source output wavelength 405nm UV Laser
Laser energy 16W
Application line application
Input file format Gerber274X
Rated voltage Single Phase 220V±10%-50HZ(L+N+PE)-4KW
Deionized water 15L
Mainframe weight 3500kg
Host size (length*width*height)  
Rated compressed air pressure 0.4 Mpa - 0.8 Mpa
Ambient temperature/ambient humidity 22ºC±2ºC/30%-70% (no condensation)
Application/input file format/performance network application/1-Bit-Tiff/133lpi 6%-94% network reproduction
Optional laser energy 20W/24W
Optional data resolution 12700dpi / 25400dpii (higher resolution imaging speed will be reduced)
 
Maximum Mesh Size 2000mm×1500mm
Maximum Imaging Size 1900mm×1400mm
Exposure mesh frame thickness 20mm-40mm
Exposed mesh frame unevenness ±0.5 mm
Graphic generator 0.95" DMD(1920*1080 [email protected]μm)
Spot size 30*30µm
Process analysis 40µm/40µm (may behave differently due to different photosensitive materials)
Process mass production 60µm/60µm (may behave differently due to different photosensitive materials)
Data resolution 6350dpi
Optical depth of field ±300µm
Focus mode dynamic real-time focus
Repeat accuracy ±5µm
Capacity (excluding Upper And Lower Substrate Time) 85s-110s/side@ 900mm×900mm & 30mj/cm² (may perform differently depending on different processes)
Exposure sensitive adhesive thickness 2~130 µm (including screen thickness)
Inhomogeneity of exposure photosensitive tape ±5%
Light source output wavelength 405nm UV Laser
Laser energy 16W
Application line application
Input file format Gerber274X
Rated voltage Three Phase 380V±10%-50HZ(A+B+C+N+PE)-6KW
Deionized water 15L
Host weight 5000kg
Host size (length * width * height)  
Rated compressed air pressure 0.4 Mpa - 0.8 Mpa
Ambient temperature/ambient humidity 22ºC±2ºC/30%-70% (no condensation)
Application/input file format/performance network application/1-Bit-Tiff/133lpi 6%-94% network reproduction
Optional laser energy 20W/24W
Optional data resolution 12700dpi / 25400dpii (higher resolution imaging speed will be reduced)

 

 
Application

Cts100/Cts200/Cts300 Screen Direct Plate Making Machine

Exhibition & Customers

Cts100/Cts200/Cts300 Screen Direct Plate Making MachineCts100/Cts200/Cts300 Screen Direct Plate Making MachineJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

Cts100/Cts200/Cts300 Screen Direct Plate Making Machine
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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