| Customization: | Available |
|---|---|
| After-sales Service: | Provide |
| Condition: | New |
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| Maximum Mesh Size | 1200mm×1000mm |
| Maximum Imaging Size | 1100mm×900mm |
| Exposure mesh frame thickness | 20mm-40mm |
| Exposed mesh frame unevenness | ±0.5 mm |
| Graphic generator | 0.7" DMD (1024*768 [email protected]) |
| Spot size | 30*30µm |
| Process analysis | 40µm/40µm (may behave differently due to different photosensitive materials) |
| Process mass production | 60µm/60µm (may behave differently due to different photosensitive materials) |
| Data resolution | 12700dpi |
| Optical depth of field | ±300µm |
| Focus mode | dynamic real-time focus |
| Repeat accuracy | ±5µm |
| Capacity (excluding upper and lower substrate time) | 135s-180s/side @ 900mm× 900mm & 30mj/cm² (may perform differently due to different processes) |
| Exposure sensitive adhesive thickness | 2~130 µm (including screen thickness) |
| Inhomogeneity of exposure photosensitive tape | ±5% |
| Light source output wavelength | 405nm UV Laser |
| Laser energy | 16W |
| Application | line application |
| Input file format | Gerber274X |
| Rated voltage | Single Phase 220V±10%-50HZ(L+N+PE)-4KW |
| Deionized water | 15L |
| Mainframe weight | 3500kg |
| Host size (length*width*height) | |
| Rated compressed air pressure | 0.4 Mpa - 0.8 Mpa |
| Ambient temperature/ambient humidity | 22ºC±2ºC/30%-70% (no condensation) |
| Application/input file format/performance | network application/1-Bit-Tiff/133lpi 6%-94% network reproduction |
| Optional laser energy | 20W/24W |
| Optional data resolution | 6350dpi / 25400dpi (higher resolution imaging speed will be reduced) |
| Maximum Mesh Size | 1300mm×1200mm |
| Maximum Imaging Size | 1200mm×1100mm |
| Exposure mesh frame thickness | 20mm-40mm |
| Exposed mesh frame unevenness | ±0.5 mm |
| Graphic generator | 0.95" DMD(1920*1080 [email protected]μm) |
| Spot size | 30*30µm |
| Process analysis | 40µm/40µm (may behave differently due to different photosensitive materials) |
| Process mass production | 60µm/60µm (may behave differently due to different photosensitive materials) |
| Data resolution | 6350dpi |
| Optical depth of field | ±300µm |
| Focus mode | dynamic real-time focus |
| Repeat accuracy | ±5µm |
| Capacity (excluding upper and lower substrate time) | 75~100s/side @ 900mm×900mm & 30mj/cm² (may perform differently due to different processes) |
| Exposure sensitive adhesive thickness | 2~130 µm (including screen thickness) |
| Inhomogeneity of exposure photosensitive tape | ±5% |
| Light source output wavelength | 405nm UV Laser |
| Laser energy | 16W |
| Application | line application |
| Input file format | Gerber274X |
| Rated voltage | Single Phase 220V±10%-50HZ(L+N+PE)-4KW |
| Deionized water | 15L |
| Mainframe weight | 3500kg |
| Host size (length*width*height) | |
| Rated compressed air pressure | 0.4 Mpa - 0.8 Mpa |
| Ambient temperature/ambient humidity | 22ºC±2ºC/30%-70% (no condensation) |
| Application/input file format/performance | network application/1-Bit-Tiff/133lpi 6%-94% network reproduction |
| Optional laser energy | 20W/24W |
| Optional data resolution | 12700dpi / 25400dpii (higher resolution imaging speed will be reduced) |
| Maximum Mesh Size | 2000mm×1500mm |
| Maximum Imaging Size | 1900mm×1400mm |
| Exposure mesh frame thickness | 20mm-40mm |
| Exposed mesh frame unevenness | ±0.5 mm |
| Graphic generator | 0.95" DMD(1920*1080 [email protected]μm) |
| Spot size | 30*30µm |
| Process analysis | 40µm/40µm (may behave differently due to different photosensitive materials) |
| Process mass production | 60µm/60µm (may behave differently due to different photosensitive materials) |
| Data resolution | 6350dpi |
| Optical depth of field | ±300µm |
| Focus mode | dynamic real-time focus |
| Repeat accuracy | ±5µm |
| Capacity (excluding Upper And Lower Substrate Time) | 85s-110s/side@ 900mm×900mm & 30mj/cm² (may perform differently depending on different processes) |
| Exposure sensitive adhesive thickness | 2~130 µm (including screen thickness) |
| Inhomogeneity of exposure photosensitive tape | ±5% |
| Light source output wavelength | 405nm UV Laser |
| Laser energy | 16W |
| Application | line application |
| Input file format | Gerber274X |
| Rated voltage | Three Phase 380V±10%-50HZ(A+B+C+N+PE)-6KW |
| Deionized water | 15L |
| Host weight | 5000kg |
| Host size (length * width * height) | |
| Rated compressed air pressure | 0.4 Mpa - 0.8 Mpa |
| Ambient temperature/ambient humidity | 22ºC±2ºC/30%-70% (no condensation) |
| Application/input file format/performance | network application/1-Bit-Tiff/133lpi 6%-94% network reproduction |
| Optional laser energy | 20W/24W |
| Optional data resolution | 12700dpi / 25400dpii (higher resolution imaging speed will be reduced) |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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