Fully Automatic Visual Positioning Wafer ID Marking Machine for Si, Sic, Inp, Gasb, GaN, Sapphire, Glass

Product Details
Customization: Available
After-sales Service: Provided
Warranty: Provided
Gold Member Since 2023

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  • Fully Automatic Visual Positioning Wafer ID Marking Machine for Si, Sic, Inp, Gasb, GaN, Sapphire, Glass
  • Fully Automatic Visual Positioning Wafer ID Marking Machine for Si, Sic, Inp, Gasb, GaN, Sapphire, Glass
  • Fully Automatic Visual Positioning Wafer ID Marking Machine for Si, Sic, Inp, Gasb, GaN, Sapphire, Glass
  • Fully Automatic Visual Positioning Wafer ID Marking Machine for Si, Sic, Inp, Gasb, GaN, Sapphire, Glass
  • Fully Automatic Visual Positioning Wafer ID Marking Machine for Si, Sic, Inp, Gasb, GaN, Sapphire, Glass
  • Fully Automatic Visual Positioning Wafer ID Marking Machine for Si, Sic, Inp, Gasb, GaN, Sapphire, Glass
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  • Overview
  • Product Description
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Laser Visibility
Visible
Laser Classification
Semiconductor Laser
Product Name
Fully Automatic Wafer ID Marking Equipment
Feature 1
Guaranteed Quality
Feature 2
Customized According to Needs
After-Sale Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

 
Product Description
Fully Automatic Visual Positioning Wafer ID Marking Machine for Si, Sic, Inp, Gasb, GaN, Sapphire, Glass

Fully automatic wafer ID marking equipment

Equipment features:
Adopting high-precision two-dimensional linear motor platform, DD motor wafer dual arm handling robot, fully automatic visual positioning, and equipment configuration with marking content verification function


Application scope:
Suitable for marking 2D codes, one-dimensional codes or characters on wafer substrates of 2-6 inch, 4-8 inch, 8-12 inch Si, SiC, InP, GaSb, GaN, Sapphire, Glass, LT and other materials

 
Fully Automatic Visual Positioning Wafer ID Marking Machine for Si, Sic, Inp, Gasb, GaN, Sapphire, Glass

 

 
Exhibition & Customers


Fully Automatic Visual Positioning Wafer ID Marking Machine for Si, Sic, Inp, Gasb, GaN, Sapphire, GlassFully Automatic Visual Positioning Wafer ID Marking Machine for Si, Sic, Inp, Gasb, GaN, Sapphire, GlassJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

Fully Automatic Visual Positioning Wafer ID Marking Machine for Si, Sic, Inp, Gasb, GaN, Sapphire, Glass
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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