| Customization: | Available |
|---|---|
| After-sales Service: | Provide |
| Condition: | New |
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| Product features | single-table standard model |
| Maximum substrate size | 630mm×730mm |
| Minimum substrate size | 300mm×300mm |
| Substrate thickness | 0.05mm~3mm |
| Process analysis L/S | 8µm/8µm |
| Line width accuracy | ±10% |
| Depth of field | ±75µm |
| Interlayer accuracy | 10µm |
| Outer alignment accuracy | ±5µm |
| Exposure time (90mj/cm² four-point position per piece, excluding upper and lower plates) | 18 seconds/face @623mm×410mm |
| Production efficiency (90mj/cm² four points per piece) | 3 sides/minute @623mm×410mm |
| Light source power | 6W |
| Number of single-machine countertops | single countertops |
| Inner circuit module | common to the inner and outer layers |
| Weight of stand-alone equipment | 5500kg |
| Single-machine size | 2940mm×1700mm×2195mm |
| Automatic wire external dimensions | 6380mm×3082mm×2455mm (excluding plate receivation machine) |
| Working height (transmission height) | 890±20mm |
| Product features | ultra-long format/roll-to-roll |
| Maximum substrate size | single-row winding 520mm |
| Minimum substrate size | 250mm roll width |
| Substrate thickness | 0.035mm~0.15mm |
| Process analysis L/S | 25µm/25µm |
| Line width accuracy | ±10% |
| Depth of field | ±200µm |
| Interlayer opposition accuracy | 20µm |
| Outer alignment accuracy | ±10µm |
| Exposure time (50mj/cm² & four-point position per piece, excluding upper and lower plates) | 14 seconds/face @250mm×1200mm |
| Production efficiency (50mj/cm² four-point position per piece) | 5m/min & 260mm roll width, 2.5m/min &520mm roll width |
| Light source power | 24W |
| Number of single-machine countertops | single countertops |
| Inner circuit module | not supported |
| Weight of stand-alone equipment | 5000kg |
| Stand-alone external dimensions | n/a |
| Automatic line size | 6100mm×2100mm×2200m |
| Working height (transmission height) | 890±20mm |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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