| Customization: | Available |
|---|---|
| After-sales Service: | Provide |
| Condition: | New |
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Application introduction:
Widely used in scientific research and production units such as aviation, aerospace, petroleum, chemical industry, shipbuilding, electronics, communications, etc., mainly used for BPO glue/PI glue/BCB glue curing, IC wafer, CMOS, Bumping, TSV, MEMS, fingerprint identification, FPD , dust-free drying of high-precision electronic components, electronic ceramic materials, drying and aging tests of electrical products, materials, spare parts, etc. in high-temperature clean and oxygen-free environments.
main feature:
It saves nitrogen (30LPM), has the characteristics of fast heating, energy saving, etc. The unique air supply and exhaust system ensures uniform temperature in the furnace box, and the metal filter ensures cleanliness requirements.
Technical indicators:
1. Long-term use temperature: 400ºC; (maximum temperature: 450ºC)
2. Temperature uniformity: ≤2%ºC;
3. Maximum heating rate: ≤6ºC/min;
4. Cooling rate: 400ºC-80ºC, ≤1.5h;
5. Ultimate vacuum degree: ≤10pa;
6. Oxygen content index: ≤50ppm at normal temperature; ≤30ppm at high temperature;
7. Cleanliness: class100;
8. Heating method: Ceramic fin heater, ring-shaped surrounding heating.
|
model |
MOLZK-32D1 |
MOLZK-118D1 |
|
Inner dimensions (mm) |
Φ350×550 (Using:235*250*350mm, 1 pc for 8-inch CST or 2 pcs for 6-inch CST) |
Φ535×940 (Using:350*350*440mm, 1 piece for 12-inch CST or 2 pieces for 8-inch CST) |
|
Number of layers |
layer |
|
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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