Wafer Size 6"- 8" Customized High Precision Semiconductor Die Bonder Die Bonding Machine for IC Package

• After-sales Service: Provided
• Condition: New
• Speed: High Speed
• Precision: High Precision
• Certification: ISO
• Warranty: 12 Months
• Automatic Grade: Automatic
• Product Name: Semiconductor Equipment
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

 

• DA801 IC Linear High-speed Die Attach

  Wafer size: 6"- 8";

  Dual dispensing system;

  High-precision linear driven bond head;

  Support DAF function;

  Multifunction work table, suitable for different kinds of lead frames & substrates;

  High-precision wafer table with highly accurate die rotation system and motorized wafer expansion system;

  Intelligent dispensing control system to realize precision glue volume control;

  Missing die detection and re-picking function;

  Customization for special design is also available.

 

 

	Item	DA801	DA801S/DA801M
System Performance	Cycle time	220ms
	X/Y placement accuracy	±25μm @30	±10-20μm @30
	Theta placement accuracy	±1°@3g
Materials Handling Capability	Die size	0.17x0.17mm-6.25x6.25mm
	Substrate dimensions	Length:110-320mm;Width:30-105mm; Thickness:0.2-2.5mm (More than 1mm, customized)	Length:110-300mm;Width:30-95mm; Thickness:0.2-2.5mm(More than 1mm, customized)
	Magazine dimensions	110-320mmx35-130mmx68-190mm (Length x Width x Height
Wafer System	Wafer size	6*-8"
	Auto-theta alignment	±10°Range
	Theta	360°
Bond Head System	Bond force	30-500 g(Programmable
Workholder System	Trackwidth	30-115 mm (Customizable)
Pattern Recognition System	PR system	Multi-color
	Resolution	640 pixelx 480 pixel (Customizable)
	Position accur acy	±1/4 pixel (±1 um @FOV 2 mm)
	Angular accuracy	±0.1°
Dimensions &Weight	Dimension	2100x1260x 1500 mm (Width x Depth x Height)
	Weight	1100kg

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.