Proximity Switch Laser Trimming Machine Equipped with High Quality Fiber Laser

• Customization: Available
• After-sales Service: Provide
• Warranty: 12 Months
• Model NO.: HTS600
• Laser Type: Fiber Laser/UV Laser
• Certification: ISO
• Condition: New
• Function: Laser Resistor Trimming
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

 

Preset the resistor to be trimmed by laser cutting in the proximity switch circuit , and the resistance value will synchronously change with thedistance parameter detected by the proximity switch . A high-speed measurement system is applied to detect the on-off level signals of the proximityswitch in real time when laser trimming the resistor . When the proximity switch outputs the required switch quantity level signal , the laser beamimmediately turns off so as to realize precise adjustment of proximity switch detection distance parameter.

System Construction
The equipment consists of optical system,laser beam positioning system,vision positioning system,measurement control system,manual platform,etc.
System Parameters
Proximity Switch Laser Trimming Machine Parameters
	Configurations	HTS600-RH	HTS601-RH
Laser system	Laser type	Fiber laser	UV laser
	Central wavelength	1064nm	355nm
	Output powe	20W	3W
	Repeat frequency	30-60kHz	20-1000kHz
	Pulse width	120-150ns	10-100ns
	Focusing mode	Manual
Laser beam positioning	Scan range	100mm*100mm
	Scan resolution	1μm
	Repeat positioning	±1μm
Positioning mode	Coaxial monitoring system	Coaxial imaging visual positioning
Loading/unloading syste	Loading/unloading mode	Manual
Work platform	Moving platform	Manual platform
	Moving range	150mm*80mm
Measurement system	Proximity switch type	3-wire DC PNP/NPN,2-wire DC normally open/closed,2-wire AC
	Dutput voltage signa	5V DC,24V DC,220V AC
	Measurement signal access	Manual

Application

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment

Packaging & Shipping