Silicon Wafer Laser Stealth Cutting Equipment Equipped with Laser Spot Shaping and Compensation Function

• Customization: Available
• After-sales Service: Provided
• Function: High Temperature Resistance
• Demoulding: Automatic
• Condition: Used
• Certification: ISO
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Desktop
• Driven Type: Electric
• Mould Life: >1,000,000 Shots
• Product Name: Laser Stealth Cutting Equipment
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• OEM/ODM Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

Equipment Advantage

Equipped with high precision linear motor and high speed X-Y motion platform

Equipped with high precision dynamic focus tracking and compensation system to ensure the stability of wafer cutting

Equipped with laser spot shaping and compensation function to improve laser efficiency and wafer cutting quality

The software is easy to operate and the equipment is convenient to maintain

Basic Parameters

• 1. Applicable Products: MEMS, RFID, etc
• 2. Applicable wafer size:200mm-300mm
• 3. Laser head:Infrared solid-state laser(Different types of wafers are matched with different wavelengths of lasers)
• 4. Cutting speed:0-1000mm/s
• 5. Processing method:full-automatic
• 6. Laser spot shaping and compensation system:SLM
• 7. Wafer surface tracking system:DFT
  

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.