| Customization: | Available |
|---|---|
| After-sales Service: | Provided |
| Condition: | New |
Suppliers with verified business licenses
Audited Supplier Audited by an independent third-party inspection agency
Fully automatic loading and unloading. Automatic reverse prevention and 2D code detection
Vision recognizes laser printed 2D codes
Automatic generation of Mapping data
SECS-GEM communication networking function. automatically obtain 2D code information and upload information
| Technical specification | |
| Laser Type | Fiber laser / green laser |
| 2D code Minimum size | 2×2mm |
| Repeatable positioning accuracy | 0.05mm |
| Track width | 10-120mm adjustable |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
){kind=link}