Expiry Date Coding Logo Printing Number Marking CO2 Laser Flying Machine for Plastic Water Bottle

• After-sales Service: Provided
• Warranty: Provided
• Laser Visibility: Visible
• Applicable Material: Metal
• Laser Wavelength: Fiber Laser
• Laser Classification: Semiconductor Laser
• Product Name: Flying Marking Machine
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

 

Product Description

Brief Description

CO2 series products are mainly applicable to non-metallic materials of high-speed flight marking, such as paper boxes (boxes, labels), plastic bottles, flexible packaging films (bags), coated metal cover (boxes, cans), glass bottles, ceramic bottles

 

Main parameter

Item	Parameter
Laser Type	CO2 Laser Coder
Minimum Code Width	0.15mm
Minimum Character Size	0.40mm
Repeatability Accuracy	±0.01mm
Standard Marking Range	100mm×100mm
Standard Focal Length	135mm
Optional Marking Range	60mm×60mm ~ 360mm×360 mm
Nominal Line Speed	≥7000mm/s
Printing Code	>500 Chars/Sec
Power Requirement	AC 220V/50HZ/10A
Overall Power Consumption	Peak≤1KW,Average≤0.5KW
Cooling Mode	Air Cooling
Level of Protection	IP54
Cable Length	3m
Machine Size	main beam:824mm×140mm×189.5mm
	main control cabinet:512mm×220mm×456mm
	lifting platform:450mm×450mm×1100mm(Customized)

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.