| Customization: | Available |
|---|---|
| After-sales Service: | Provided |
| Warranty: | Provided |
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Product overview:
MPS-0606LM is a product specially for the small format precision laser cutting market. It is mainly used for cutting metal sheets and ceramic substrates, with a closed structure, superior performance, stability, and extremely high cost-effectiveness.
1. Use a stable Dinglongmen marble platform.
2. The entire machine adopts high-quality linear motors and high-resolution grating rulers, with high accuracy and processing efficiency.
3. Stable equipment, user-friendly operation interface, real-time feedback of processing status, ensuring the orderly progress of cutting and processing.
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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