Good Cutting Quality High Precision Laser Cutting Equipment for Slicing/Cutting /Drilling of High-Precision Sheets

• After-sales Service: Provided
• Warranty: Provided
• Application: Home Appliance, Environmental Equipment, Automotive Industry
• Cooling System: Water Cooling
• Technical Class: Continuous Wave Laser
• Applicable Material: Metal
• Model NO.: MPS-0303L
• Product Name: Plate Tube Optical Fiber Laser Cutting Machine
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

 

Product Description

Product overview:
mps-0303lp fiber laser cutting machine adopts high-performance linear motor, high-resolution grating ruler, fixed gantry marble platform and high-precision control system, which greatly meets the customer's demand for high-precision processing.

Product features:
Special laser, good cutting section, fast cutting speed.
Linear motor platform, full feedback system, platform speed, high precision.
Using high precision vision positioning system, the positioning accuracy is high.
The dust extraction effect of the machine is good, and the dustproof effect of the platform is good.
The machine has compact structure, small volume and space saving.
Small material and strip clamp can be selected for high applicability.
It adopts the custom control system of Han's super power, which has the characteristics of high reliability and humanized operation.
High quality fiber laser generator, over 30% photoelectric conversion efficiency, high-quality laser light source mode, ensure good cutting effect and efficient processing efficiency, greatly reduce laser energy consumption.

Application fields:
Mps-0303lp is specialized in precision machining such as slicing, cutting and drilling of high-precision sheets, mainly including sheet metal processing in electronic industry.

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.