China Factory Chip Testing and Detection Wafer Bonder Semiconductor Sorting Equipment

Product Details
Customization: Available
After-sales Service: Provided
Condition: New
Gold Member Since 2023

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  • China Factory Chip Testing and Detection Wafer Bonder Semiconductor Sorting Equipment
  • China Factory Chip Testing and Detection Wafer Bonder Semiconductor Sorting Equipment
  • China Factory Chip Testing and Detection Wafer Bonder Semiconductor Sorting Equipment
  • China Factory Chip Testing and Detection Wafer Bonder Semiconductor Sorting Equipment
  • China Factory Chip Testing and Detection Wafer Bonder Semiconductor Sorting Equipment
  • China Factory Chip Testing and Detection Wafer Bonder Semiconductor Sorting Equipment
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  • Overview
  • Product Description
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
SHF9000
Speed
High Speed
Precision
High Precision
Certification
ISO
Warranty
12 Months
Automatic Grade
Automatic
Product Name
Sorting Machine
Feature 1
Guaranteed Quality
Feature 2
Customized According to Needs
After-Sale Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Product Description
China Factory Chip Testing and Detection Wafer Bonder Semiconductor Sorting Equipment

China Factory Chip Testing and Detection Wafer Bonder Semiconductor Sorting Equipment

China Factory Chip Testing and Detection Wafer Bonder Semiconductor Sorting Equipment

Equipment Specifications
  PIaK PLACE HANDLER   SHF9000
  Test station   1/2/4/8 site
  Nozzle module   1×4 mode
  Test mode   Room temperature
  Material handling cart   Supports 1X2,1X4,2x2,2x4
  Index time   <400ms
  UPH (QFN5X5)   (1x4 mode),No-load UPH≥6700,Test time 1.2s UPH≥6500
  (2x2 mode),No-load UPH≥8300,Test time 1.2s UPH≥8000
  (2x4 mode),No-load UPH≥8300,Test time 1.2s UPH≥8000
  Package   QFN/QFP/CPS/BGA/LGA,etc
  Packaging size   3mm×3mm~50mm×50mm
  Suitable for tray   Standard JEDEC tray
 Material collection method   3 automatic receiving trays,3 manual receiving trays
  Communication method   RS232,TTL,GPIB,NetWork
  Jam Rate   <1/5000
  MTBA   >60 minutes
  MTBF   >168 hours
  ESD protection   Ground resistance<12;±1000V→ ±10V<10s
China Factory Chip Testing and Detection Wafer Bonder Semiconductor Sorting Equipment
Exhibition & Customers

China Factory Chip Testing and Detection Wafer Bonder Semiconductor Sorting EquipmentChina Factory Chip Testing and Detection Wafer Bonder Semiconductor Sorting EquipmentJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

China Factory Chip Testing and Detection Wafer Bonder Semiconductor Sorting Equipment
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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