Semiconductor Vacuum Reflow Welding for Semiconductor Power Devices

Product Details
Customization: Available
After-sales Service: Online Service
Function: High Temperature Resistance
Diamond Member Since 2023

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  • Semiconductor Vacuum Reflow Welding for Semiconductor Power Devices
  • Semiconductor Vacuum Reflow Welding for Semiconductor Power Devices
  • Semiconductor Vacuum Reflow Welding for Semiconductor Power Devices
  • Semiconductor Vacuum Reflow Welding for Semiconductor Power Devices
  • Semiconductor Vacuum Reflow Welding for Semiconductor Power Devices
  • Semiconductor Vacuum Reflow Welding for Semiconductor Power Devices
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  • Overview
  • Product Description
  • Exhibition & Customers
  • Field Application
  • Packaging & Shipping
  • After Sales Service
  • FAQ
Overview

Basic Info.

Model NO.
HMLA-HX02
Demoulding
Automatic
Condition
New
Certification
ISO
Warranty
12 Months
Automatic Grade
Automatic
Installation
Vertical
Driven Type
Electric
Mould Life
300,000-1,000,000 Shots
Transport Package
Air Freight
Specification
0*0*0
Trademark
Himalaya
Origin
China
Production Capacity
200

Product Description

Product Description
 


Semiconductor Vacuum Reflow Welding for Semiconductor Power Devices
 
Basic Parameter
Equipment Model HMLA-612D HMLA-613D
Equipment size(mm) L6300*D1450*H1560 L6300*D1450*H1560
Equipment weight APPROX:3000KG APPROX:3100KG
Number of heating areas There are 12 heating zones in the upper 6 and the bottom 6 There are 12 heating zones in the upper 6 and the bottom 6
Number of cooling areas There are 4 cooling zones in the upper 2 and the bottom 2 There are 6 cooling zones in the upper 3 and the bottom 3
Cooling-down method Forced water cooling
Air exhaust requirements 10m/H*2
Voidage APPROX:1%-2%
Control System
Power requirement 3P 380V50/60Hz 3P 380V50/60Hz
Total power 60KW 64KW
Segmental start power 35KW 35KW
Consumed power APPROX:12KW-18KW APPROX:13KW-18KW
Heat fan speed regulation Variable frequency stepless speed regulation
Heat up time APPROX:30min
Temperature control range Room temperature ~ 400ºC can be set
Commercial formulation Multiple combination production formulas can be stored
Transit System
Transit system single track
track structure 33 section combination structure
Vehicle size(mm) L330*D250 L330*D330
Transport belt height(mm) 900±20
Mode of transport Equidistant push plate
Vacuum System
Minimum vacuum pressure 0.1Kpa
Vacuum pump flow APPROX:1000L/min APPROX:1000L/min
Pressure relief time ≤10s
production efficiency ≥40s
Optional nitrogen system
Nitrogen structure /Full-course / local nitrogen charge
Nitrogen system Automatic or manually switchable
Nitrogen consumption APPROX:300-500L/min

 

Exhibition & Customers

Semiconductor Vacuum Reflow Welding for Semiconductor Power Devices

Field Application

 

Semiconductor Vacuum Reflow Welding for Semiconductor Power Devices
Packaging & Shipping
Semiconductor Vacuum Reflow Welding for Semiconductor Power DevicesSemiconductor Vacuum Reflow Welding for Semiconductor Power DevicesSemiconductor Vacuum Reflow Welding for Semiconductor Power Devices

 

After Sales Service

 

Semiconductor Vacuum Reflow Welding for Semiconductor Power Devices

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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