Lpd-Fa Laser Drilling Machine Using The High-Speed Laser Drilling Control System of Acousto-Optic Devices

• After-sales Service: Provide
• Condition: New
• Certification: ISO
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Model NO.: LPD-FA
• Driven Type: Electric
• Product Name: Laser Drilling Machine
• Application: Circuit Board
• Advantage: Factory Price
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

Product advantages
using the high-speed laser drilling control system of acousto-optic devices
real-time detection
rapid zoom within 100ns level can change laser spot energy density and size
high-precision

Application field	circuit board
Processing material	FPC copper plate
Plate thickness range	≤1.0mm
Drilling speed	≥300 holes/s (Material,12μmCu/25μmPI/12μmCu,75μm BVH/TVH)
Drilling accuracy	X&Y axis ≤±20μm, pore CPK≥1.33
Effective processing size	550mm×650mm
Fixed mode	vacuum adsorption platform
Drilling aperture range	≥25μm, PI or copper burr ≤3μm
True roundness	TOP≥90%, BOT≥90% (Material,12μmCu/25μmPI/12μmCu,75μm BVH/TVH)
Aperture tolerance	≤±5%
Taper (upper and lower aperture ratio)	Taper (hole bottom/hole top)≥80% (Material-12μmCu/25μmPI/12μmCu.75μm BVH/TVH)
Drive system	vibrating mirror platform linkage
Positioning accuracy	±2μm
Repeat positioning accuracy	±1μm
Maximum acceleration of the machine	1.5G
Precision positioning	5 million pixels 1.6mmx1.2mm
Rough positioning	5 million pixels 9.6mmx7.2mm
Surveillance camera	130W, 30mmx30mm
Focus spot size	≤25μm
Equipment size	length× width × height = 1500mm×600mm×1700mm (excluding tricolor lamps)
Equipment weight	2100kg
Equipment power supply	AC 3x380V/25A
Equipment gas source	0.4-0.6MPa
Base material	marble base

 

 

Application

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.