Customized Cutting System Precision Laser Cutting Equipment for Electronic Devices/Instruments and Meters

• Customization: Available
• After-sales Service: Provided
• Warranty: Provided
• Model NO.: MPS-1010D
• Application: Home Appliance, Environmental Equipment, Automotive Industry, Advertising Industry
• Cooling System: Water Cooling
• Technical Class: Continuous Wave Laser
• Applicable Material: Metal
• Product Name: Precision Laser Cutting Machine
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

 

Product Description

MPS-1010D is a product specially for the metal sheet industry, mainly used for cutting 0.5mm-16mm metal flat plates. It has a closed structure, superior performance, stability, and extremely high cost-effectiveness.

Product features:
1. High strength integrated cast aluminum alloy crossbeam.
2. The entire machine adopts high-quality servo motors and a high-precision dual drive screw transmission structure, with high precision and processing efficiency.
3. The equipment is stable, with a user-friendly operation interface and real-time feedback on the processing status, ensuring the orderly progress of cutting and processing.

Applicable material range:
Professional application for cutting various metal materials such as carbon steel plates, stainless steel plates, galvanized plates, electrolytic plates, aluminum alloys, brass, and copper.
Application field:
Suitable for industries such as glasses frame processing, hardware accessories, electronic devices, instruments and meters, gold and silver jewelry, diaphragm couplings, automotive parts, textile machinery, etc.

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.