High-Precision Rectifying and Rewinding Flying Marking Machine for Pharmaceutical/Food/ Daily Chemical Industries

• After-sales Service: Provided
• Warranty: Provided
• Laser Visibility: Visible
• Applicable Material: Metal
• Laser Wavelength: Fiber Laser
• Laser Classification: Semiconductor Laser
• Product Name: Flying Marking Machine
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

 

Product Description

Brief Description

The whole machine can cover 6-9 channes, productivity for single channel is ≥ 240pcs/min.

Using the DRACO series of short-wave lasers with the independent intellectual property rights of Han's Laser, the printing ink layer absorbs the laser to produce chemical changes, forming a discoloration with obvious contrast.
Code effect. There is no obvious thermal effect in the coding process, and there is no damage to the film material. It can be widely used in various types of information marking such as flexible packaging three-phase, one-dimensional bar code and two-dimensional code.

 

Features:
1. The integrated high-precision rectifying and rewinding machine realizes automatic unwinding, winding, rectification, laser coding and joint control of the whole reel.
2. Flexible packaging with multiple rows of code, the maximum width of the coil can meet 900mm.
3. Widely used in pharmaceutical, food, daily chemical and other industries, flexible film packaging characters, two-dimensional code and other information marks

 

 

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.