CO2 Metal RF Laser PCB Bar Codes/FPC/Ceramics/Semiconductors/Crystal Glass Laser Engraving Marking Machine

• After-sales Service: Provided
• Warranty: Provided
• Laser Visibility: Visible
• Applicable Material: Metal
• Cooling System: Air Cooling
• Laser Wavelength: CO2 Laser
• Model NO.: CO2-H120/H200
• Laser Classification: Semiconductor Laser
• Product Name: CO2 Laser Marking
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

It can be widely used in graphic marks on craft gifts, food packaging, electronic components, PCB bar codes, FPC, ceramics, semiconductors, crystal glass, plastic parts, silicone rubber products and other non-metallic materials, as well as cutting.

 

Features
Advanced processing model, high efficiency, low cost;
Full automation, easy to operate;
Environmental friendly;
Easy to identify products.
Specification

Mode	CO2-H120	CO2-H200
Laser	CO2 metal RF laser	CO2 metal RF laser
Wavelength	10.64um	10.64um
Max output power	120W	180W
Repetition frequency	≤25kHz	≤25kHz
Marking area	120mm×120mm	120mm×120mm
Marking speed	≤7000mm/s	≤7000mm/s
Min line width	0.1mm	0.1mm
Min Character	0.6mm	0.6mm
Cooling mode	Water cooling	Water cooling
Repetition accuracy	±0.01mm	±0.01mm
Overall size	1780mm×415mm×1190mm	1780mm×415mm×1190mm
Power supply	220V/Single phase/50Hz/20A	220V/Single phase/50Hz/20A
Lens	140*140/B	140*140/B
IPC	Great Wall	Great Wall
Monitor	17" LED monitor	17" LED monitor
Galvanometer system	Han's  CXY	Han's  CXY
Software	HLM_V1.0	HLM_V1.0
Marking control card	EMCC marking control card	EMCC marking control card
Water cooler	Han's  HC035L5-01A(UB)	Han's  HC025L5-01A(UB)

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.