Wafer Laser Scribing / Cutting Machine for Taiko Ring Cutting, Si/Sic Wafer Cutting

Product Details
Customization: Available
Condition: New
Warranty: 12 Months
Gold Member Since 2023

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  • Wafer Laser Scribing / Cutting Machine for Taiko Ring Cutting, Si/Sic Wafer Cutting
  • Wafer Laser Scribing / Cutting Machine for Taiko Ring Cutting, Si/Sic Wafer Cutting
  • Wafer Laser Scribing / Cutting Machine for Taiko Ring Cutting, Si/Sic Wafer Cutting
  • Wafer Laser Scribing / Cutting Machine for Taiko Ring Cutting, Si/Sic Wafer Cutting
  • Wafer Laser Scribing / Cutting Machine for Taiko Ring Cutting, Si/Sic Wafer Cutting
  • Wafer Laser Scribing / Cutting Machine for Taiko Ring Cutting, Si/Sic Wafer Cutting
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  • Overview
  • Product Description
  • Application
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Automatic Grade
Automatic
Installation
Vertical
Driven Type
Electric
Product Name
Wafer Laser Scribing / Cutting
Feature 1
High Reliability and Stability
Feature 2
Sic Wafer Cutting
OEM/ODM Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Product Description
Wafer Laser Scribing / Cutting Machine for Taiko Ring Cutting, Si/Sic Wafer Cutting
Product Features
  • Multiple laser operation modes and beam shaping, ensuring optimal incision quality and efficiency

  • Correction technology ensures high precision machining and consistency

  • Auto-positioning, auto-focusing, auto-detection, ensuring high yield rate

  • Support warpage/TAIKO wafer transfer

Technical specification
Laser wavelength 355nm
Laser output power 15/30W
Processing method Combined scanning and linear/rotary stage motion
Positioning accuracy ±1μm
Processing accuracy ±5μm
Wafer size 6 inch, 8 inch, 12 inch
Chipping <10μm
Application


Wafer Laser Scribing / Cutting Machine for Taiko Ring Cutting, Si/Sic Wafer Cutting

Exhibition & Customers

Wafer Laser Scribing / Cutting Machine for Taiko Ring Cutting, Si/Sic Wafer CuttingWafer Laser Scribing / Cutting Machine for Taiko Ring Cutting, Si/Sic Wafer CuttingJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

Wafer Laser Scribing / Cutting Machine for Taiko Ring Cutting, Si/Sic Wafer Cutting
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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