Semi-Automatic Double Spindle Grinder

• Customization: Available
• After-sales Service: 1 Year
• Warranty: 1 Year
• Model NO.: HMLA-2035
• Maximum Wafer Size: 8 Inch
• Grinding Wheel Specification: Ø203(Od)mm
• Grinding Wheel Spindle Power: 6.0 Kw
• Label: Allowed
• Transport Package: Wooden Case
• Specification: 0*0*0
• Trademark: none
• Origin: China

Product Description

Product Description

 

 

This semi-automatic double spindle grinder is suitable for grinding 2"-12" wafers and materials to special specifications. In addition to manual loading, simple operations, and abundant functions, single and double-spindle processing modes are included. In double-spindle mode, the product is moved to the fine grinding position after rough grinding. It is also equipped with an automatic thickness measurement and compensation system to improve grinding accuracy. The operations surface can be customized according to customer requirements, achieving excellent results across a wide range of applications.

 

Features

1. Flexible operation
Manual loading and unloading, wafer dry in wet out

2. Comprehensive functions
Automatic measurement of thickness, multi-stage

3. Good compatibility
Suitable for a variety of semiconductor materials suitable for thinning 2"-12"wafer

4. Abundant configurations
Double-spindle grinding unit

 

Company

 

Our Partner

 

Packaging & Shipping

After Sales Service