| Customization: | Available |
|---|---|
| After-sales Service: | Provided |
| Warranty: | Provided |
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Product Introduction:
The MPS-D series laser cutting machine is a high configuration and high-performance fiber laser cutting machine tailored for the metal cutting and forming market. The MPS-D series laser cutting machine adopts imported servo drives, customized systems, and other configurations, greatly meeting the needs of customers.
Product characteristics:
1. The product adopts gantry structure, high-quality steel welding bed, honeycomb high-strength beam, combined with excellent heat treatment and machining technology, to ensure the rigidity of the machine tool and the stability of long-term use.
2. After years of mature use and continuous optimization in the field of laser cutting, Han's control system has achieved high performance, reliability, humanization and convenience of operation.
3. Servo motor double drive precision reducer and gear rack structure ensure the high-quality dynamic performance of the equipment.
4. With advanced air circuit control system design and supporting imported pneumatic components, customers can freely use high and low pressure cutting auxiliary gas according to their needs, so as to ensure cutting quality and effectively reduce the use cost.
Application industries: various mechanical manufacturing and processing industries such as rail transit, shipbuilding, automobiles, engineering machinery, agricultural and forestry machinery, electrical manufacturing, elevator manufacturing, household appliances, grain machinery, textile machinery, tool processing, petroleum machinery, food machinery, kitchen utensils and bathroom, decorative advertising, laser external processing services, etc.
Applicable materials: various metal materials such as carbon steel, stainless steel, aluminum alloy, brass, copper, pickled plate, galvanized plate, silicon steel plate, electrolytic plate, titanium alloy, manganese alloy, etc.
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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