| Customization: | Available |
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| After-sales Service: | Provide |
| Condition: | New |
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Product Usage:
Integrated circuit wafer glue, BPO glue/PI glue/BCB glue curing, IC (wafer, CMOS, Bumping, TSV,
MEMS, fingerprint recognition; rapid annealing of integrated circuit wafers.
Features:
1. Integrated human-machine operating system, continuous automated production, high work efficiency, saving labor costs, electricity and process time;
2. FEC heating, rapid temperature rise and good uniformity;
3. Made of high-quality stainless steel, the surface has been physically and chemically polished to ensure cleanliness;
4. Comes with self-cleaning function - high temperature cleaning.
Technical Parameters
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Handling products |
8/12inch wafer |
Throughput |
75PCS/tube, total150PCS |
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heater |
Round FEC heating plate |
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Feeding port |
4_ |
Manipulator |
1 |
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temperature range |
Long-term use temperature: 350ºC, maximumtemperature:750ºC |
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Heating rate |
<8ºC/min |
cooling rate |
<7ºC/min |
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heating power |
30kW(single furnace)*2 |
Heating temperature zone |
3*2_ |
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Furnace temperature uniformity |
±2ºC (350ºCconstant temperature) |
Temperature control thermocouple |
K graduation |
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Temperature control method |
SSR |
Program control |
PID control |
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Furnace material |
quartz |
Insulation Materials |
Ceramic fiber |
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atmosphere control |
Multi-channel flowmeter regulates air intake:flow metering range: 1)0-150L/minnitrogen2)0-40L/minoxygen |
atmosphere |
N2/O2 |
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Exhaust system |
Set up an exhaust chimney at the top for waste gas emission and recovery |
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Control System
*The human-machine interface adopts touch screen mode
*The core controller adopts embedded controller
*Over-temperature protection is an independent detection device
*With oxygen content detection function
*Motion control is servo/stepper control unit
*Transmission is a professional wafer transfer robot
*The software has functions: temperature control, atmosphere control, process editing, data recording, and chart display.
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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