Wafer Chamfering Equipment, Manual Wafer Chamfering Machine, Wafer Chamfering Machine, Wafer Chamfering Machine Field

• Customization: Available
• After-sales Service: 1 Year
• Warranty: 1 Year
• Model NO.: HMLA-ZKW06
• Semiconductor Equipment: 2-4inch/4-8inch
• Wafer Thickness: 300um ~1200um Customizable
• Suitable for Wafer Shape: of Edges or Wafer Edges
• Wafer Edge Shape: T\R\Tt\Rr\Tr (Customizable)
• Transport Package: Wooden Case
• Specification: 0*0*0
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

 

A.Equipment introduction

This wafer chamfering machine is a precision semiconductor production equipment, which is specially used for the precise edge chamfering treatment of silicon wafers, silicon carbide or sapphire wafers to eliminate burrs and sharp edges generated after cutting, improve the quality of wafer edges, and ensure the yield and safety in the subsequent chip manufacturing process.
 

B.Main technical parameters

Model	HMLA-100	HMLA-200
Wafer size	2-4Inch	4-8Inch
Wafer thickness	300um ~1200um  customizable
Suitable for wafer shape	OF edges or wafer edges
Wafer edge shape	T,R,TT,RR,TR (customizable)
0F length	5mm~65mm
0F shoulder fillet radius	0 ~20mm
Number of grinding circles	1~5
Maximum speed of grinding wheel	6000rpm
Grinding speed	1mm/s ~50mm/s
precision	±0.01mm
Processing mode	Nc completes the wafer contour chamfering
Wafer fixation method	Vacuum adsorption (customizable
Wafer positioning mode	Mechanical fixture positioning
Special function	Custom processing of shaped wafers
Man-machine interface	Touch screen
Cooling water	0.3MPa ,RO water
Compressed air	0.55MPA
Exhaust air	10L/MIN
Ambient temperature	10ºC-28ºC
Power requirement	220VAC±10%, single phase, 50Hz or 60Hz, 15A
Equipment weight	600KG

 

C.Preparation before operation

3.1 Ensure that the power connection is stable and reliable and well grounded;
3.2 Check whether all components are in good condition, including but not limited to protective cover, workbench vacuum cups, grinding wheels, drives, etc;
3.3 Check whether the initial setting of the chamfer is correct before operation;
3.4 Confirm whether the cooling water (pressure requirement 0.3Mpa) and compressed air (0.55MPA) are opened;
3.5 Check whether the drainage water is connected to the sewer pipe.

 

Exhibition & Customers

Field Application

 

Packaging & Shipping

 

After Sales Service

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.