Product Description
1. Product size compatibility: 8-12 inch bare wafer;
2. Equipped with a wafer loading system called Loadport, supporting FOUP loading;
3. Robot robotic arm film transmission;
4. Automatic calibrator: corrects the center and angle of the wafer;
5. The product edge can be marked with an ID;
6. Equipped with automatic scanning function;
7. OCR recognition detection (optional)
8. It can be connected to the customer's company system and supports SECS/GEM functions;
9. Optional air purification system FFU and smoke and dust collection and filtration system.
N software supports fonts
>SEMI: 5x9 single line density/10x18 double line density
>Arabic font
>Barcode BC-412 SEMI T1
>QR code \ DM (optional)
>Support customization
Main technical parameters of the equipment
Control system
Galvanometer square head+control card, Windows 7/10
Laser wavelength
532nm
Laser cooling method
Water cooling/air cooling
Support file formats
Dxf, plt
Power supply
Single phase 220V, 4KW (excluding smoke and dust filter)
Arm rotation lifting
Movable range 315 mm * 340 ° 300 mm*
Average handling speed 570 mm/sec 220 °/sec 200 mm/sec
Maximum handling speed 1140 mm/sec 270 °/sec 250 mm/sec
Precision below 12.6 µ m 0.0045 ° 6.25 µ m
Handling height 620mm * (height from the base fixing surface to the wafer mounting surface on the finger)
Repeatability accuracy within ± 0.1mm
There are three types of wafer size compatibility to choose from: 2-4-6 inches; 4-8 inches; -12 inches
Cleanliness ISO Class 2 (under independent exhaust conditions inside the drive structure)
Factory affairs
Power supply: DC24V ± 10% 16A; Vacuum: better than -53kPa
(Bernoulli suction cup uses compressed air, with an adjustable pressure of 0.5MPa)
Edge Finder Parameters
Items being transported
SEMI specification wafer
(Flexible customization design can be made according to the shape and material of special wafers)
There are three types of wafer size compatibility to choose from: 2-4-6 inches; 4-6-8 inches; 8-12 inches
Time required for location determination to locate the center of the wafer: 3 seconds
Position accuracy
Wafer center: within ± 0.1 mm
Wafer edge/gap: within ± 0.1 °
Detection of wafer edges using sensor LED lighting and image recognition sensors
Wafer size switching command control mode/communication mode
Cleanliness ISO Class 2 (under independent exhaust conditions inside the drive structure)
The power three-axis uses a 2-phase stepper motor, and the motor controller and pulse generator are installed inside the body
Factory affairs
Power supply: DC24V ± 10% 3A; Vacuum: better than -53kPa
(Bernoulli suction cup uses compressed air, with an adjustable pressure of 0.5MPa)
Dust collector parameters
External dimensions (mm) 640 × five hundred and fifty × one thousand three hundred and twenty-two
Weight (kg) 105
Maximum air volume (m) ³/ h) 265
Maximum negative pressure (mbar) 230
Rated power (kW) 2.2
Voltage (V/Hz) 220/50
Control protection external control&digital display pressure&alarm output
Noise (dB) 70 ± 2
Exhaust pipe diameter (mm) φ seventy-five
Filtering efficiency ≥ 99% 0.3 µ m
Manual cleaning method (automatic beep reminder)
Exhibition & Customers
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Packaging & Shipping
FAQ
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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