Jiangsu, China
Business Type:
Trading Company
Number of Employees:
11
Year of Establishment:
2019-09-12
Plant Area:
83 square meters
Average Lead Time:
Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months
OEM/ODM Service
Sample Available
Overseas Agent / Branch

Die Bonder, Wire Bonding manufacturer / supplier in China, offering High Precision Semiconductor Equipment Automatic High Precision Die Bonder, Semiconductor Equipment Heavy Wire Bonder, Semiconductor Equipment High Precision Multi-Chip Die Bonder and so on.

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Wafer Marking

Total 7 Wafer Marking Products