Single Tube Fully Automatic Vertical Furnace (PI Cuer, annealing, alloy)

• After-sales Service: Provide
• Condition: New
• Certification: ISO
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Electric
• Product Name: Fully Automatic Vertical Furnace
• Application: Integrated Circuit Wafer Glue, Bpo Glue
• Feature 1: Fec Heating
• Feature 2: Rapid Temperature Rise
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

 

Product Usage:
Integrated circuit wafer glue, BPO glue/PI glue/BCB glue curing, IC (wafer, CMOS, Bumping, TSV,
MEMS, fingerprint recognition; rapid annealing of integrated circuit wafers.

 

Features:

1. Integrated human-machine operating system, continuous automated production, high work efficiency, saving labor costs, electricity and process time;

2. FEC heating, rapid temperature rise and good uniformity;

3. Made of high-quality stainless steel, the surface has been physically and chemically polished to ensure cleanliness;

4. Comes with self-cleaning function - high temperature cleaning.

 

Technical Parameters

 

 

Handling products		8/12inch wafer	Throughput		75PCS/tube, total150PCS
heater		Round FEC heating plate
Feeding port		4_	Manipulator		1
temperature range		Long-term use temperature: 350ºC, maximumtemperature:750ºC
Heating rate		<8ºC/min		cooling rate	<7ºC/min
heating power		30kW(single furnace)*2		Heating temperature zone	3*2_
Furnace temperature uniformity		±2ºC (350ºCconstant temperature)		Temperature control thermocouple	K graduation
Temperature control method		SSR		Program control	PID control
Furnace material		quartz		Insulation Materials	Ceramic fiber
atmosphere control	Multi-channel flowmeter regulates air intake:flow metering range: 1)0-150L/minnitrogen2)0-40L/minoxygen				atmosphere	N2/O2
Exhaust system	Set up an exhaust chimney at the top for waste gas emission and recovery

 

 

Control System

*The human-machine interface adopts touch screen mode

*The core controller adopts embedded controller

*Over-temperature protection is an independent detection device

*With oxygen content detection function

*Motion control is servo/stepper control unit

*Transmission is a professional wafer transfer robot

*The software has functions: temperature control, atmosphere control, process editing, data recording, and chart display.

 

Application

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.