| Customization: | Available |
|---|---|
| After-sales Service: | Provided |
| Warranty: | Provided |
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It can be widely used in graphic marks on craft gifts, food packaging, electronic components, PCB bar codes, FPC, ceramics, semiconductors, crystal glass, plastic parts, silicone rubber products and other non-metallic materials, as well as cutting.
Characters
Advanced processing model, high efficiency, low cost;
Full automation, easy to operate;
Environmental friendly;
Easy to identify products.
Specification
| Mode | CO2-D30 | CO2-D55 |
| Laser | CO2 metal RF laser | metal RF laser |
| Wavelength | 10.64um | 10.64um |
| Max output power | 30W | 30W |
| Repetition frequency | ≤25kHz | ≤25kHz |
| Marking area | 85mm×85mm | 85mm×85mm |
| Marking speed | ≤7000mm/s | ≤7000mm/s |
| Min line width | 0.1mm | 0.1mm |
| Min Character | 0.8mm | 0.8mm |
| Cooling mode | Air cooling | Air cooling |
| Repetition accuracy | ±0.01mm | ±0.01mm |
| Overall size | 1120mm×620mm×1370mm | 1120mm×620mm×1370mm |
| Power supply | 220V/Single phase/50Hz | 2220V/Single phase/50Hz |
| Lens | 85 | 85 |
| IPC | Great Wall | Great Wall |
| Monitor | 17" LED monitor | 17" LED monitor |
| Galvanometer system | Han's CXY | Han's CXY |
| Software | HLM_V1.0 | HLM_V1.0 |
| Marking control card | EMCC marking control card | EMCC marking control card |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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