Semiconductor Devices Automatic High-Speed Lead Wire Welding and Bonding Machine

• Customization: Available
• After-sales Service: Provide
• Warranty: 12 Months
• Model NO.: QXH-3116
• Product Name: Lead Wedge Welding and Bonding Machine
• Ultrasonic Power: (0-10) W
• Certification: ISO
• Condition: New
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

 

Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the significant increase in microwave integrated component production and stricter quality requirements, fully automatic lead wire bonding machines with high efficiency, accuracy, and consistency in bonding quality have become essential process equipment for microwave integrated component manufacturing.

The fully automatic lead wedge welding bonding machine is mainly used to complete the lead bonding process, achieve a solid electrical connection between two solder pads on the device, and can be widely used in the manufacturing of semiconductor devices, hybrid circuits, microwave devices, and components. The main product features include high bonding efficiency, high precision, multiple types of solderable gold wires, controllable lead arc, and machine vision teaching and programming.

Function Description:

The lead arc can be set according to the process; Full process visualization programming;

Save product process data; Online monitoring of welding quality;

The bonding pressure can be precisely controlled; Chopper counting function;

Main technical parameters:

Bond strength: meets the requirements of method 2011.1 in GJB548B-2005;

Wire diameter size: Φ (18-50) μ M; XYZ axis repetition accuracy: ± 3 μ M;

Welding range: 150 x 150 (mm); Welding pressure: 5GF~150GF;

Maximum cavity depth: 10mm; Maximum temperature of heating table: 200 ºC;

Ultrasonic power: (0-10) W; Transformer frequency: 98 ± 3kHz;

Bonding speed (depending on product situation): 1.2 seconds per line (actual product).

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.