| Customization: | Available |
|---|---|
| After-sales Service: | Provide |
| Condition: | New |
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Mainly used in the production of precision ceramic devices such as alumina, zirconia ceramics, and dielectric ceramics, as well as in the sintering process of special ITO ceramic target products under oxygen environment.
The furnace is fixed with a special riveting structure, which will not crack or collapse during long-term use
Linear guide rail design, smooth and vibration free movement, extremely convenient and safe for loading and unloading products
Pre embedded corundum mullite at the bottom of the burning plate to enhance support and prevent sinking of the burning plate
Over temperature protection function, automatically power-off due to over temperature
| Equipment model | usage temperature | volume | furnace size (L×W×H) |
Heating element | thermocouple | voltage | rise and fall mode | power | |||||||||
| FZL-200/16 | 1600ºC | 200L | 600×600×550mm | Silicon molybdenum rod | B | 380V | screw | 60KW | |||||||||
| FZL-320/16 | 1600ºC | 320L | 1200×480×550mm | Silicon molybdenum rod | B | 380V | screw | 100KW | |||||||||
| FZL-430/16 | 1600ºC | 430L | 1200×600×600mm | Silicon molybdenum rod | B | 380V | screw | 110KW | |||||||||
| FZL-815/16 | 1600ºC | 815L | 1600×850×600mm | Silicon molybdenum rod | B | 380V | screw | 160KW | |||||||||
| FZL-200/17 | 1700ºC | 200L | 600×600×550mm | Silicon molybdenum rod | B | 380V | screw | 60KW | |||||||||
| FZL-320/17 | 1700ºC | 320L | 1200×480×550mm | Silicon molybdenum rod | B | 380V | screw | 100KW | |||||||||
| FZL-430/17 | 1700ºC | 430L | 1200×600×600mm | Silicon molybdenum rod | B | 380V | screw | 110KW | |||||||||
| FZL-815/17 | 1700ºC | 815L | 1600×850×600mm | Silicon molybdenum rod | B | 380V | screw | 160KW | |||||||||
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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