Pre Firing Integrated Furnace Mainly for Precision Dispensing of Aluminum Nitride Ceramic Substrates

• Customization: Available
• After-sales Service: Provide
• Condition: New
• Certification: ISO
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Electric
• Product Name: Pre Firing Integrated Furnace
• Application: Silicon Nitride Ceramic Substrates
• Advantage: Factory Price
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

Mainly used for precision dispensing of aluminum nitride ceramic substrates, silicon nitride ceramic substrates, dielectric ceramics, SOFC solid fuel cell cells, nitrogen oxygen sensors, and other alumina and zirconia products, including dispensing pre firing, LED lamp dispensing pre firing, LTCC dispensing sintering, piezoelectric ceramic dispensing sintering, ceramic core dispensing sintering, ceramic heaters, and electronic cigarette porous ceramic atomization core dispensing sintering, The integrated process of 3D ceramic printing, adhesive pre firing, and adhesive sintering for ceramic and electronic components through various molding methods.

Characteristic:
The maximum temperature is 1100 ºC and 1300 ºC (two models of temperature are available for selection).
The combination of low-temperature convection and high-temperature radiation allows for more thorough and even pre sintering of the adhesive.
The replacement of heating elements is convenient, and it is safer to open the door, cut off the power, and close the door for power on.

 

Application

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.