Sic Single Crystal Growth Furnace Provides Customers with Silicon Carbide Material, Process and Equipment System Integration Solutions

• After-sales Service: Provide
• Warranty: 12 Months
• Product Name: Sic Equipment
• Function: Sic Single Crystal Growth Furnace
• Certification: ISO
• Condition: New
• Model NO.: SiC equipment
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

  The production process equipment and application of silicon carbide materials are the core industries of the second institute focusing on third-generation semiconductor technology. Relying on independently developed core processes and equipment such as long crystal furnaces, laser glass equipment, and epitaxial furnaces, we integrate domestic and foreign resources, provide customers with integrated solutions for silicon carbide materials, processes, and equipment systems, break foreign monopolies, and help the rapid development of China's third-generation semiconductor industry.

SiC single crystal growth furnace

Silicon carbide material production process equipment and application is the core industry focusing on the third generation semiconductor technology. Relying on the self-developed core processes and equipment such as long crystal furnace, laser glass equipment and epitaxial furnace, the second Institute integrates domestic and foreign resources, provides customers with silicon carbide material, process and equipment system integration solutions, breaks foreign monopoly and helps the rapid development of China's third generation semiconductor industry.

 

SIC epitaxial growth equipment

This equipment is used for the growth of 6-8 inch SiC epitaxial films and provides high-quality epitaxial wafers for SiC chip manufacturing in the third generation semiconductor fields such as microwave, radio frequency and power electronics.

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.