| Customization: | Available |
|---|---|
| Certification: | ISO |
| Warranty: | Provided |
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Standard Features
1. 2 valves can be accommodated in the standard machine
2. PC with LCD monitors, keyboard and mouse
3. Auto dipping and purging waste collection system
4. LED UV lamps for inspection
5. PCB clamping system
6. ESD grounding point
7. CE certified
Optional Features
1. Heavy duty conveyor
2. Dual lane conveyor system
3. 2 stage conveyor
4. CCD vision camera
5. 2 nozzles simultaneous coating and tilt
6. Material level detection
7. Pallet return conveyor (underneath)
8. Barcode or 2D code scanning system
9. Material tank : 1 gal / 3 gal / 5 gal / 10 gal
10. UPS and voltage stabilizer
1. Fast speed and stable operation;
2. Greatly improving efficiency - Spraying mode can be changed without interruption during work;
3. Flexible multi-axis control - can be used to achieve complex PCB board of high difficulty spraying;
4. Four kinds of valves - can be selected to meet different coating requirements;
5. Strong process control ability - ensure coating quality and consistency;
6. Easy to achieve online selective coating function;
7. Other functions, including two-dimensional code, bar code scanning, automatic adjustment and anti-stay program.
| Type | Specifications | iCoat-3 | iCoat-3A | iCoat-3B | iCoat-3C | ||
| Coating parameters |
Working area (mm) | X=450 Y=450 Z=100 |
X=200 Y=450 Z=100 |
X=220 Y=450 Z=100 |
X=200 Y=440 Z=100 |
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| Maximum components height (mm) |
±90 |
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| PCB edge clearance(mm) | ≥ 5 |
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| Single spray width(mm) | 2-30 |
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| Transmission System | Process flow | Left→right ( standard ) right→left |
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| Conveyor height(mm) | 900±20 |
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| Conveyor speed (m/min) | 2-13 |
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| Operation system |
Number of valve | Dual valves in a row (fixed width) |
Dual valves + tilt; manual adjustable width) |
Four valves in a row+ tilt |
Four valves front & back + front and back tilt |
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| Max.moving speed(mm/s) | 800 |
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| Repeatability(mm) | ±0.02 |
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| Equipment parameters |
Dimensions (mm) | L=900; W=1300; H=1675; |
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| Weight(kg) | 530 |
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| Required Air Supply(Mpa) | ≥ 0.4 |
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| Exhaust air volume (m3/min) |
15 |
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| Power supply | AC220V 50/60Hz |
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| Rated power (kw) | 2.2 |
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| Control and operation system |
Control | Integrated microprocessor controllers |
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| Software | Anda user interface software with Windows |
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| Programming | keyboard / mouse mode |
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| Communication protocol | SMEMA |
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Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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