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Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu, China
Business Type:
Trading Company
Main Products:
Die Bonder , Wire Bonding , Laser Marking(ID IC Wafer) , Laser Grooving , Laser Cutting , ...
Number of Employees:
11
Year of Establishment:
2019-09-12
Plant Area:
83 square meters
Average Lead Time:
Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months
OEM/ODM Service
Sample Available
Overseas Agent / Branch
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Die Bonder, Wire Bonding manufacturer / supplier in China, offering Focused Double Beam Microscope Ion&Electron Beam Analysis Instrument, Precision Focused Ion&Electron Double Beam Microscope, Focused Ion&Electron Double Beam Microscope Precision Material Analysis Instrument and so on.

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Mr. Jack
Deputy General Manager
Product Groups

All Products

Total 903 Products
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Video
High Speed Fully Automatic Gold/Copper Wire Bonder
High Speed Fully Automatic Gold/Copper Wire Bonder
FOB Price: US $60,000-170,000 / Box
Min. Order: 1 Box
Contact Now
Video
Fully Automatic Laser Grooving Equipment for Semiconductor Wafers
Fully Automatic Laser Grooving Equipment for Semiconductor Wafers
FOB Price: US $550,000-1,000,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
Semiconductor Fully Automatic IC Marking Machine
Semiconductor Fully Automatic IC Marking Machine
FOB Price: US $100,000-3,000,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
Fully Automatic ID Laser Marking Machine
Fully Automatic ID Laser Marking Machine
FOB Price: US $28,000-160,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
Fully Automatic 8-12 Inches Wafer Marking Equipment with a Crystal Loading System
Fully Automatic 8-12 Inches Wafer Marking Equipment with a Crystal Loading System
FOB Price: US $130,000-500,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
Frame Laser Marking Machine with Integrated Post Label Detection System
Frame Laser Marking Machine with Integrated Post Label Detection System
FOB Price: US $100,000-200,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms
Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms
FOB Price: US $620,000-1,000,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
High End Manufacturing Laser Sealing Machine
High End Manufacturing Laser Sealing Machine
FOB Price: US $68,493-136,986 / Piece
Min. Order: 1 Piece
Contact Now
Video
High End Laser Processing Ceramic Equipment
High End Laser Processing Ceramic Equipment
FOB Price: US $200,000-2,000,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
High End Ceramic Punching Equipment with High Precision Laser Processing System
High End Ceramic Punching Equipment with High Precision Laser Processing System
FOB Price: US $200,000-1,000,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
Semiconductor Wafer Laser Stealth Cutting Equipment
Semiconductor Wafer Laser Stealth Cutting Equipment
FOB Price: US $700,000-1,000,000 / Set
Min. Order: 1 Set
Contact Now
Video
4/6/8-Inch Wafer Production Sic Laser Annealing Equipment with a Vacuum Cracking System
4/6/8-Inch Wafer Production Sic Laser Annealing Equipment with a Vacuum Cracking System
FOB Price: US $1,400,000-2,000,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
Automated Handling System Mobile Robots Used for Indoor Logistics Operations
Automated Handling System Mobile Robots Used for Indoor Logistics Operations
FOB Price: US $70,000-2,000,000 / Set
Min. Order: 1 Set
Contact Now
Video
High End Wafer ID Automatic&Manual Setting Storage Chip Automatic Detection Equipment
High End Wafer ID Automatic&Manual Setting Storage Chip Automatic Detection Equipment
FOB Price: US $500,000-2,000,000 / Set
Min. Order: 1 Set
Contact Now
Video
Professional High End Fully Automatic Laser Debonding Equipment with Good Stability
Professional High End Fully Automatic Laser Debonding Equipment with Good Stability
FOB Price: US $1,000,000-3,000,000 / Set
Min. Order: 1 Set
Contact Now
Video
High End Fully Automatic Fpca/PCBA/Pi/Pet Laser Cutting Equipment
High End Fully Automatic Fpca/PCBA/Pi/Pet Laser Cutting Equipment
FOB Price: US $100,000-2,000,000 / Set
Min. Order: 1 Set
Contact Now
Video
High End Fully Automatic IC Reel Packaging Equipment for Semiconductor Industry Process
High End Fully Automatic IC Reel Packaging Equipment for Semiconductor Industry Process
FOB Price: US $1,000,000-2,000,000 / Set
Min. Order: 1 Set
Contact Now
Video
High Speed Fully Automatic Testing and Sorting Machine for Semiconductor Device
High Speed Fully Automatic Testing and Sorting Machine for Semiconductor Device
FOB Price: US $100,000-1,000,000 / Set
Min. Order: 1 Set
Contact Now
Video
Tgv High-End Precision Laser Drilling Machine Suitable for Processing Brittle Materials
Tgv High-End Precision Laser Drilling Machine Suitable for Processing Brittle Materials
FOB Price: US $500,000-2,000,000 / Set
Min. Order: 1 Set
Contact Now
8-Inch Silicon Wafer Semi Chip Standard Chip High End Lithography Machine Equipment
8-Inch Silicon Wafer Semi Chip Standard Chip High End Lithography Machine Equipment
FOB Price: US $2,000,000-4,000,000 / Set
Min. Order: 1 Set
Contact Now
Video
High End Semiconductor Wafer Saw Machine
High End Semiconductor Wafer Saw Machine
FOB Price: US $200,000-500,000 / Set
Min. Order: 1 Set
Contact Now
Video
High End Semiconductor Fully Automatic Laser Ring Cutting Machine
High End Semiconductor Fully Automatic Laser Ring Cutting Machine
FOB Price: US $100,000-1,000,000 / Set
Min. Order: 1 Set
Contact Now
Video
High End Semiconductor Chip Fully Automatic Laser Overflow Removal Equipment
High End Semiconductor Chip Fully Automatic Laser Overflow Removal Equipment
FOB Price: US $90,000-2,000,000 / Set
Min. Order: 1 Set
Contact Now
Video
High End Semiconductor Chip Fully Automatic Cracking Machine with Wafer Splitting Device
High End Semiconductor Chip Fully Automatic Cracking Machine with Wafer Splitting Device
FOB Price: US $100,000-1,000,000 / Set
Min. Order: 1 Set
Contact Now

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